Masaki Kasai

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,069,591
- Issue date Jul 20, 2021
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,431,516
- Issue date Oct 1, 2019
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 9,601,441
- Issue date Mar 21, 2017
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 9,312,228
- Issue date Apr 12, 2016
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 9,111,819
- Issue date Aug 18, 2015
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding with stress relief connection pads
- Patent number 9,018,762
- Issue date Apr 28, 2015
- Rohm Co., Ltd.
- Masaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 8,928,156
- Issue date Jan 6, 2015
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 8,786,106
- Issue date Jul 22, 2014
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with front and back side resin layers having d...
- Patent number 8,723,339
- Issue date May 13, 2014
- Rohm Co., Ltd.
- Masaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with front and back side resin layers having d...
- Patent number 8,664,779
- Issue date Mar 4, 2014
- Rohm Co., Ltd.
- Masaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 8,575,764
- Issue date Nov 5, 2013
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding with stress relief connection pads
- Patent number 8,446,008
- Issue date May 21, 2013
- Rohm Co., Ltd.
- Masaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with front and back side resin layers having d...
- Patent number 8,164,201
- Issue date Apr 24, 2012
- Rohm Co., Ltd.
- Masaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 7,714,448
- Issue date May 11, 2010
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210313245
- Publication date Oct 7, 2021
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190393116
- Publication date Dec 26, 2019
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170162463
- Publication date Jun 8, 2017
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160181210
- Publication date Jun 23, 2016
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150311165
- Publication date Oct 29, 2015
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150091169
- Publication date Apr 2, 2015
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140291845
- Publication date Oct 2, 2014
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140077373
- Publication date Mar 20, 2014
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FRONT AND BACK SIDE RESIN LAYERS HAVING D...
- Publication number 20140070413
- Publication date Mar 13, 2014
- Rohm Co., Ltd.
- Masaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE BONDING WITH STRESS RELIEF CONNECTION PADS
- Publication number 20130234327
- Publication date Sep 12, 2013
- Rohm Co., Ltd.
- Masaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FRONT AND BACK SIDE RESIN LAYERS HAVING D...
- Publication number 20120193766
- Publication date Aug 2, 2012
- Rohm Co., Ltd.
- Masaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing semiconductor device
- Publication number 20100187659
- Publication date Jul 29, 2010
- ROHM CO., LTD.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20100044863
- Publication date Feb 25, 2010
- Rohm Co., Ltd.
- Masaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Semiconductor Device Assembly
- Publication number 20090121347
- Publication date May 14, 2009
- Rohm Co., Ltd.
- Masaki Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20080272488
- Publication date Nov 6, 2008
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Manufacturing Semiconductor Device
- Publication number 20080006910
- Publication date Jan 10, 2008
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS

Masaki Kasai

Person

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device bonding with stress relief connection pads

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device with front and back side resin layers having d...

Semiconductor device with front and back side resin layers having d...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device bonding with stress relief connection pads

Semiconductor device with front and back side resin layers having d...

Semiconductor device and method for manufacturing semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH FRONT AND BACK SIDE RESIN LAYERS HAVING D...

SEMICONDUCTOR DEVICE BONDING WITH STRESS RELIEF CONNECTION PADS

SEMICONDUCTOR DEVICE WITH FRONT AND BACK SIDE RESIN LAYERS HAVING D...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device

Semiconductor Device and Semiconductor Device Assembly

Semiconductor Device

Semiconductor Device and Method for Manufacturing Semiconductor Device