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Masaki KAWATA
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Yasu-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Resin circuit board and resin circuit board having component mounte...
Patent number
10,278,289
Issue date
Apr 30, 2019
Murata Manufacturing Co., Ltd.
Kuniaki Yosui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing resin multilayer substrate
Patent number
10,098,238
Issue date
Oct 9, 2018
Murata Manufacturing Co., Ltd.
Masaki Kawata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Component-embedded substrate
Patent number
9,974,185
Issue date
May 15, 2018
Murata Manufacturing Co., Ltd.
Shigeru Tago
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing resin multilayer board
Patent number
9,961,780
Issue date
May 1, 2018
Murata Manufacturing Co., Ltd.
Hirofumi Shinagawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Module component
Patent number
9,854,677
Issue date
Dec 26, 2017
Murata Manufacturing Co., Ltd.
Shigeru Tago
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Grant
Production method of component-embedded substrate, and component-em...
Patent number
9,730,322
Issue date
Aug 8, 2017
Murata Manufacturing Co., Ltd.
Yuki Wakabayashi
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Electronic component module
Patent number
7,615,874
Issue date
Nov 10, 2009
Murata Manufacturing Co., Ltd.
Tsuyoshi Suesada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
RESIN MULTILAYER SUBSTRATE MANUFACTURING METHOD
Publication number
20190053386
Publication date
Feb 14, 2019
Murata Manufacturing Co., Ltd.
Masaki KAWATA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
RESIN CIRCUIT BOARD AND RESIN CIRCUIT BOARD HAVING COMPONENT MOUNTE...
Publication number
20180182680
Publication date
Jun 28, 2018
Murata Manufacturing Co., Ltd.
Kuniaki YOSUI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULE COMPONENT
Publication number
20160330843
Publication date
Nov 10, 2016
Murata Manufacturing Co., Ltd.
Shigeru TAGO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
COMPONENT-EMBEDDED SUBSTRATE
Publication number
20160157354
Publication date
Jun 2, 2016
MURATA MANUFACTURING CO., LTD.
Shigeru TAGO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING RESIN MULTILAYER BOARD
Publication number
20160050766
Publication date
Feb 18, 2016
MURATA MANUFACTURING CO., LTD.
Hirofumi Shinagawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING RESIN MULTILAYER SUBSTRATE
Publication number
20160044798
Publication date
Feb 11, 2016
MURATA MANUFACTURING CO., LTD.
Masaki KAWATA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRODUCTION METHOD OF COMPONENT-EMBEDDED SUBSTRATE, AND COMPONENT-EM...
Publication number
20160029489
Publication date
Jan 28, 2016
Murata Manufacturing Co., Ltd.
Yuki WAKABAYASHI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC COMPONENT MODULE
Publication number
20090260856
Publication date
Oct 22, 2009
Murata Manufacturing Co., Ltd.
Tsuyoshi SUESADA
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
ELECTRONIC COMPONENT MODULE
Publication number
20070200221
Publication date
Aug 30, 2007
Murata Manufacturing Co., Ltd.
Tsuyoshi SUESADA
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...