Masaki Mizutani

Person

Ibaraki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Optical film with pressure sensitive adhesive on both sides and met...
- Patent number 9,841,545
- Issue date Dec 12, 2017
- Nitto Denko Corporation
- Masaki Mizutani
- G02 - OPTICS
Information Patent Grant
Photosensitive resin composition and circuit board with metal suppo...
- Patent number 8,877,427
- Issue date Nov 4, 2014
- Nitto Denko Corporation
- Masaki Mizutani
- G11 - INFORMATION STORAGE
Information Patent Grant
Dicing/die-bonding film, method of fixing chipped work and semicond...
- Patent number 8,586,415
- Issue date Nov 19, 2013
- Nitto Denko Corporation
- Takeshi Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Suspension board with circuit and producing method thereof
- Patent number 8,525,037
- Issue date Sep 3, 2013
- Nitto Denko Corporation
- Masaki Mizutani
- G11 - INFORMATION STORAGE
Information Patent Grant
Photosensitive resin composition, flexible circuit board employing...
- Patent number 8,492,453
- Issue date Jul 23, 2013
- Nitto Denko Corporation
- Masaki Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive resin composition, flexible circuit board employing...
- Patent number 8,455,577
- Issue date Jun 4, 2013
- Nitto Denko Corporation
- Masaki Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive resin composition, flexible circuit board employing...
- Patent number 8,372,903
- Issue date Feb 12, 2013
- Nitto Denko Corporation
- Masaki Mizutani
Information Patent Grant
Dicing die-bonding film
- Patent number 8,304,341
- Issue date Nov 6, 2012
- Nitto Denko Corporation
- Takeshi Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing/die-bonding film, method of fixing chipped work and semicond...
- Patent number 8,178,420
- Issue date May 15, 2012
- Nitto Denko Corporation
- Takeshi Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing wiring circuit board
- Patent number 8,026,045
- Issue date Sep 27, 2011
- Nitto Denko Corporation
- Masaki Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive resin composition and flexible printed wiring circui...
- Patent number 7,910,631
- Issue date Mar 22, 2011
- Nitto Denko Corporation
- Hirofumi Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dicing die-bonding film
- Patent number 7,863,182
- Issue date Jan 4, 2011
- Nitto Denko Corporation
- Takeshi Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing die-bonding film, method of fixing chipped work and semicond...
- Patent number 7,780,811
- Issue date Aug 24, 2010
- Nitto Denko Corporation
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing/die-bonding film, method of fixing chipped work and semicond...
- Patent number 7,646,103
- Issue date Jan 12, 2010
- Nitto Denko Corporation
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing die-bonding film
- Patent number 7,508,081
- Issue date Mar 24, 2009
- Nitto Denko Corporation
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing die-bonding film, method of fixing chipped work and semicond...
- Patent number 7,449,226
- Issue date Nov 11, 2008
- Nitto Denko Corporation
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing/die-bonding film, method of fixing chipped work and semicond...
- Patent number 7,060,339
- Issue date Jun 13, 2006
- Nitto Denko Corporation
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet resin composition and process for manufacturing semiconductor...
- Patent number 6,884,695
- Issue date Apr 26, 2005
- Amkor Technology, Inc.
- Hirotaka Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet resin composition and process for manufacturing semiconductor...
- Patent number 6,620,862
- Issue date Sep 16, 2003
- Amkor Technology, Inc.
- Hirotaka Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the production of semiconductor device
- Patent number 6,333,206
- Issue date Dec 25, 2001
- Nitto Denko Corporation
- Satoshi Ito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fabrication process of a semiconductor device
- Patent number 6,200,830
- Issue date Mar 13, 2001
- Nitto Denko Corporation
- Satoshi Ito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSPARENT RESIN LAYER, PRESSURE-SENSITIVE-ADHESIVE-LAYER-ATTACHED...
- Publication number 20170121565
- Publication date May 4, 2017
- NITTO DENKO CORPORATION
- Atsushi Yasui
- B32 - LAYERED PRODUCTS
Information Patent Application
OPTICAL FILM WITH PRESSURE SENSITIVE ADHESIVE AND IMAGE DISPLAY DEVICE
- Publication number 20160237319
- Publication date Aug 18, 2016
- Nitto Denko Corporation
- Shou TAKARADA
- B32 - LAYERED PRODUCTS
Information Patent Application
DOUBLE-SIDED PRESSURE-SENSITIVE-ADHESIVE-LAYER-ATTACHED POLARIZING...
- Publication number 20160209566
- Publication date Jul 21, 2016
- Nitto Denko Corporation
- Atsushi YASUI
- G02 - OPTICS
Information Patent Application
PRESSURE-SENSITIVE-ADHESIVE-LAYER-ATTACHED POLARIZING FILM, AND IMA...
- Publication number 20160185083
- Publication date Jun 30, 2016
- Nitto Denko Corporation
- Atsushi Yasui
- B32 - LAYERED PRODUCTS
Information Patent Application
OPTICAL FILM WITH PRESSURE SENSITIVE ADHESIVE ON BOTH SIDES AND MET...
- Publication number 20160109631
- Publication date Apr 21, 2016
- Nitto Denko Corporation
- Masaki MIZUTANI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
OPTICAL FILM WITH PRESSURE SENSITIVE ADHESIVE AND PRODUCTION METHOD...
- Publication number 20160102229
- Publication date Apr 14, 2016
- Nitto Denko Corporation
- Shou TAKARADA
- B32 - LAYERED PRODUCTS
Information Patent Application
PRESSURE SENSITIVE ADHESIVE AND IMAGE DISPLAY DEVICE USING THE SAME
- Publication number 20160002505
- Publication date Jan 7, 2016
- NITTO DENKO CORPORATION
- Masaki MIZUTANI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
OPTICAL FILM WITH PRESSURE SENSITIVE ADHESIVE ON BOTH SIDES AND MET...
- Publication number 20150346408
- Publication date Dec 3, 2015
- NITTO DENKO CORPORATION
- Masaki MIZUTANI
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20120211263
- Publication date Aug 23, 2012
- Nitto Denko Corporation
- Masaki MIZUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF
- Publication number 20120175151
- Publication date Jul 12, 2012
- NITTO DENKO CORPORATION
- Masaki MIZUTANI
- G11 - INFORMATION STORAGE
Information Patent Application
DICING/DIE-BONDING FILM, METHOD OF FIXING CHIPPED WORK AND SEMICOND...
- Publication number 20120088333
- Publication date Apr 12, 2012
- Takeshi Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SUSPENSION BOARD WITH A CIRCUIT FOR USE IN A HARD DISK DRIVE
- Publication number 20120067625
- Publication date Mar 22, 2012
- Nitto Denko Corporation
- Masaki Mizutani
- G11 - INFORMATION STORAGE
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT BOARD WITH METAL SUPPO...
- Publication number 20120067626
- Publication date Mar 22, 2012
- Nitto Denko Corporation
- Masaki Mizutani
- G11 - INFORMATION STORAGE
Information Patent Application
DICING DIE-BONDING FILM
- Publication number 20110147952
- Publication date Jun 23, 2011
- Takeshi Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, FLEXIBLE CIRCUIT BOARD EMPLOYING...
- Publication number 20110030998
- Publication date Feb 10, 2011
- Nitto Denko Corporation
- Masaki Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, FLEXIBLE CIRCUIT BOARD EMPLOYING...
- Publication number 20100270060
- Publication date Oct 28, 2010
- Nitto Denko Corporation
- Masaki Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DICING/DIE-BONDING FILM, METHOD OF FIXING CHIPPED WORK AND SEMICOND...
- Publication number 20100093155
- Publication date Apr 15, 2010
- Takeshi Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING DIE-BONDING FILM
- Publication number 20090149003
- Publication date Jun 11, 2009
- Takeshi Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION AND FLEXIBLE PRINTED WIRING CIRCUT...
- Publication number 20090101394
- Publication date Apr 23, 2009
- Nitto Denko Corporation
- Hirofumi FUJII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WIRING CIRCUIT BOARD
- Publication number 20080241759
- Publication date Oct 2, 2008
- Nitto Denko Corporation
- Masaki MIZUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION FOR FLEXIBLE CIRCUIT BOARD AND FLE...
- Publication number 20080097000
- Publication date Apr 24, 2008
- Nitto Denko Corporation
- Hirofumi FUJII
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION FOR FLEXIBLE CIRCUIT BOARD AND FLE...
- Publication number 20080063955
- Publication date Mar 13, 2008
- Nitto Denko Corporation
- Hirofumi FUJII
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DICING DIE-BONDING FILM, METHOD OF FIXING CHIPPED WORK AND SEMICOND...
- Publication number 20070137782
- Publication date Jun 21, 2007
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dicing/die-bonding film, method of fixing chipped work and semicond...
- Publication number 20060148131
- Publication date Jul 6, 2006
- Takeshi Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Dicing die-bonding film
- Publication number 20050208736
- Publication date Sep 22, 2005
- Takeshi Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Dicing/die-bonding film, method of fixing chipped work and semicond...
- Publication number 20050046042
- Publication date Mar 3, 2005
- Takeshi Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Dicing die-bonding film, method of fixing chipped work and semicond...
- Publication number 20040241910
- Publication date Dec 2, 2004
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesives composition, adhesive film, and semiconductor apparatus u...
- Publication number 20040230000
- Publication date Nov 18, 2004
- Sadahito Misumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Sheet resin composition and process for manufacturing semiconductor...
- Publication number 20030207117
- Publication date Nov 6, 2003
- Hirotaka Ueda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Sheet resin composition and process for manufacturing semiconductor...
- Publication number 20020001688
- Publication date Jan 3, 2002
- Hirotaka Ueda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Masaki Mizutani

Person

Patents Grantslast 30 patents

Optical film with pressure sensitive adhesive on both sides and met...

Photosensitive resin composition and circuit board with metal suppo...

Dicing/die-bonding film, method of fixing chipped work and semicond...

Suspension board with circuit and producing method thereof

Photosensitive resin composition, flexible circuit board employing...

Photosensitive resin composition, flexible circuit board employing...

Photosensitive resin composition, flexible circuit board employing...

Dicing die-bonding film

Dicing/die-bonding film, method of fixing chipped work and semicond...

Method of manufacturing wiring circuit board

Photosensitive resin composition and flexible printed wiring circui...

Dicing die-bonding film

Dicing die-bonding film, method of fixing chipped work and semicond...

Dicing/die-bonding film, method of fixing chipped work and semicond...

Dicing die-bonding film

Dicing die-bonding film, method of fixing chipped work and semicond...

Dicing/die-bonding film, method of fixing chipped work and semicond...

Sheet resin composition and process for manufacturing semiconductor...

Sheet resin composition and process for manufacturing semiconductor...

Process for the production of semiconductor device

Fabrication process of a semiconductor device

Patents Applicationslast 30 patents

TRANSPARENT RESIN LAYER, PRESSURE-SENSITIVE-ADHESIVE-LAYER-ATTACHED...

OPTICAL FILM WITH PRESSURE SENSITIVE ADHESIVE AND IMAGE DISPLAY DEVICE

DOUBLE-SIDED PRESSURE-SENSITIVE-ADHESIVE-LAYER-ATTACHED POLARIZING...

PRESSURE-SENSITIVE-ADHESIVE-LAYER-ATTACHED POLARIZING FILM, AND IMA...

OPTICAL FILM WITH PRESSURE SENSITIVE ADHESIVE ON BOTH SIDES AND MET...

OPTICAL FILM WITH PRESSURE SENSITIVE ADHESIVE AND PRODUCTION METHOD...

PRESSURE SENSITIVE ADHESIVE AND IMAGE DISPLAY DEVICE USING THE SAME

OPTICAL FILM WITH PRESSURE SENSITIVE ADHESIVE ON BOTH SIDES AND MET...

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF

DICING/DIE-BONDING FILM, METHOD OF FIXING CHIPPED WORK AND SEMICOND...

SUSPENSION BOARD WITH A CIRCUIT FOR USE IN A HARD DISK DRIVE

PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT BOARD WITH METAL SUPPO...

DICING DIE-BONDING FILM

PHOTOSENSITIVE RESIN COMPOSITION, FLEXIBLE CIRCUIT BOARD EMPLOYING...

PHOTOSENSITIVE RESIN COMPOSITION, FLEXIBLE CIRCUIT BOARD EMPLOYING...

DICING/DIE-BONDING FILM, METHOD OF FIXING CHIPPED WORK AND SEMICOND...

DICING DIE-BONDING FILM

PHOTOSENSITIVE RESIN COMPOSITION AND FLEXIBLE PRINTED WIRING CIRCUT...

METHOD OF MANUFACTURING WIRING CIRCUIT BOARD

PHOTOSENSITIVE RESIN COMPOSITION FOR FLEXIBLE CIRCUIT BOARD AND FLE...

PHOTOSENSITIVE RESIN COMPOSITION FOR FLEXIBLE CIRCUIT BOARD AND FLE...

DICING DIE-BONDING FILM, METHOD OF FIXING CHIPPED WORK AND SEMICOND...

Dicing/die-bonding film, method of fixing chipped work and semicond...

Dicing die-bonding film

Dicing/die-bonding film, method of fixing chipped work and semicond...

Dicing die-bonding film, method of fixing chipped work and semicond...

Adhesives composition, adhesive film, and semiconductor apparatus u...

Sheet resin composition and process for manufacturing semiconductor...

Sheet resin composition and process for manufacturing semiconductor...