Masaki Morikawa

Person

Kasukabe, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Composite cards
- Patent number 5,626,937
- Issue date May 6, 1997
- Mitsubishi Materials Corporation
- Masaki Morikawa
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Grant
Precious metal article, method for manufacturing same, moldable mix...
- Patent number 5,376,328
- Issue date Dec 27, 1994
- Mitsubishi Materials Corporation
- Koji Hoshino
- B44 - DECORATIVE ARTS
Information Patent Grant
Composite cards
- Patent number 5,364,482
- Issue date Nov 15, 1994
- Mitsubishi Materials Corporation
- Masaki Morikawa
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Grant
Moldable mixture for use in the manufacturing of precious metal art...
- Patent number 5,328,775
- Issue date Jul 12, 1994
- Mitsubishi Materials Corporation
- Koji Hoshino
- B44 - DECORATIVE ARTS
Information Patent Grant
Platinum-cobalt alloy sputtering target and method for manufacturin...
- Patent number 5,282,946
- Issue date Feb 1, 1994
- Mitsubishi Materials Corporation
- Makoto Kinoshita
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Composite cards
- Patent number 5,120,589
- Issue date Jun 9, 1992
- Mitsubishi Materials Corporation
- Masaki Morikawa
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Grant
Wire for bonding a semiconductor device
- Patent number 4,717,436
- Issue date Jan 5, 1988
- Mitsubishi Kinzoku Kabushiki Kaisha
- Naoyuki Hosoda
- C30 - CRYSTAL GROWTH
Information Patent Grant
Wire for bonding a semiconductor device and process for producing t...
- Patent number 4,676,827
- Issue date Jun 30, 1987
- Mitsubishi Kinzoku Kabushiki Kaisha
- Naoyuki Hosoda
- C30 - CRYSTAL GROWTH
Information Patent Grant
Cobalt alloy for build-up welding having improved resistance to wel...
- Patent number 4,659,632
- Issue date Apr 21, 1987
- Mitsubishi Kinzoku Kabushiki Kaisha
- Masaki Morikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper alloy having high resistance to oxidation for use in leads o...
- Patent number 4,632,806
- Issue date Dec 30, 1986
- Mitsubishi Kinzoku Kabushiki Kaisha
- Masaki Morikawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy having high resistance to oxidation for use in leads o...
- Patent number 4,525,434
- Issue date Jun 25, 1985
- Mitsubishi Kinzoku Kabushiki Kaisha
- Masaki Morikawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Cu-Ag base alloy brazing filler material
- Patent number 4,416,853
- Issue date Nov 22, 1983
- Mitsubishi Kinzoku Kabushiki Kaisha
- Masaki Morikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu-Ag-Si Base alloy brazing filler material
- Patent number 4,411,864
- Issue date Oct 25, 1983
- Mitsubishi Kinzoku Kabushiki Kaisha
- Masaki Morikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing stripe-patterned metal plate
- Patent number 4,354,301
- Issue date Oct 19, 1982
- Mitsubushi Kinzoku Kabushiki Kaisha
- Yo Takeuchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for welding copper materials
- Patent number 4,134,001
- Issue date Jan 9, 1979
- Mitsubishi Kinzoku Kabushiki Kaisha
- Yo Takeuchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Masaki Morikawa

Person

Patents Grantslast 30 patents

Composite cards

Precious metal article, method for manufacturing same, moldable mix...

Composite cards

Moldable mixture for use in the manufacturing of precious metal art...

Platinum-cobalt alloy sputtering target and method for manufacturin...

Composite cards

Wire for bonding a semiconductor device

Wire for bonding a semiconductor device and process for producing t...

Cobalt alloy for build-up welding having improved resistance to wel...

Copper alloy having high resistance to oxidation for use in leads o...

Copper alloy having high resistance to oxidation for use in leads o...

Cu-Ag base alloy brazing filler material

Cu-Ag-Si Base alloy brazing filler material

Method for manufacturing stripe-patterned metal plate

Process for welding copper materials