Masaki Nakanishi

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Patents Grantslast 30 patents

Information Patent Grant
Method of thinning a semiconductor substrate using a perforated sup...
- Patent number 6,492,195
- Issue date Dec 10, 2002
- Hitachi, Ltd.
- Masaki Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20010005043
- Publication date Jun 28, 2001
- Masaki Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS