Masaki Okawara

Person

  • Sayama, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding apparatus

    • Patent number 6,070,780
    • Issue date Jun 6, 2000
    • Kabushiki Kaisha Shinkawa
    • Masayuki Shimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR