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Masaki TSUNODA
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Tokyo, JP
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last 30 patents
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Patent Grant
Bonding method, bonding device, and holding member
Patent number
12,080,554
Issue date
Sep 3, 2024
Nikon Corporation
Hajime Mitsuishi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Substrate bonding apparatus and substrate bonding method
Patent number
11,791,223
Issue date
Oct 17, 2023
Nikon Corporation
Isao Sugaya
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Bonding method, bonding device, and holding member
Patent number
11,004,686
Issue date
May 11, 2021
Nikon Corporation
Hajime Mitsuishi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
Publication number
20240387177
Publication date
Nov 21, 2024
Nikon Corporation
Hajime MITSUISHI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
Publication number
20240014079
Publication date
Jan 11, 2024
Nikon Corporation
Isao SUGAYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE BONDING DEVICE, CALCULATION DEVICE, SUBSTRATE BONDING MET...
Publication number
20210242044
Publication date
Aug 5, 2021
Nikon Corporation
Hajime MITSUISHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
Publication number
20210225651
Publication date
Jul 22, 2021
Nikon Corporation
Hajime MITSUISHI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
Publication number
20190267238
Publication date
Aug 29, 2019
Nikon Corporation
Hajime MITSUISHI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
Publication number
20180308770
Publication date
Oct 25, 2018
Nikon Corporation
Isao SUGAYA
H01 - BASIC ELECTRIC ELEMENTS