Masaki Waki

Person

Satsuma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 6,716,675
- Issue date Apr 6, 2004
- Fujitsu Limited
- Masaki Waki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for a vertically accumulable semiconductor device with ex...
- Patent number 6,433,418
- Issue date Aug 13, 2002
- Fujitsu Limited
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a lead portion with outer connecting te...
- Patent number 6,255,740
- Issue date Jul 3, 2001
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having tab-leads and a fabrication method thereof
- Patent number 6,080,604
- Issue date Jun 27, 2000
- Fujitsu Limited
- Masaki Waki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing the semiconductor dev...
- Patent number 6,060,768
- Issue date May 9, 2000
- Fujitsu Limited
- Katsuhiro Hayashida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 5,984,699
- Issue date Nov 16, 1999
- Fujitsu Limited
- Masaki Waki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having tab leads
- Patent number 5,701,028
- Issue date Dec 23, 1997
- Fujitsu Limited
- Masaki Waki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semicondutor device having a lead portion wit...
- Patent number 5,656,550
- Issue date Aug 12, 1997
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a plurality of chips
- Patent number 5,530,292
- Issue date Jun 25, 1996
- Fujitsu Limited
- Masaki Waki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a plurality of semiconductor chips
- Patent number 5,479,051
- Issue date Dec 26, 1995
- Fujitsu Limited
- Masaki Waki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a plurality of chips
- Patent number 5,463,253
- Issue date Oct 31, 1995
- Fujitsu Limited
- Masaki Waki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of ejecting an encapsulated semiconductor device from a mol...
- Patent number 5,447,888
- Issue date Sep 5, 1995
- Fujitsu Limited
- Akira Takashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device, method of manufacturing semiconductor device,...
- Publication number 20030006501
- Publication date Jan 9, 2003
- FUJITSU LIMITED
- Masaki Waki
- H01 - BASIC ELECTRIC ELEMENTS

Masaki Waki

Person

Patents Grantslast 30 patents

Semiconductor device, method of manufacturing semiconductor device,...

Apparatus for a vertically accumulable semiconductor device with ex...

Semiconductor device having a lead portion with outer connecting te...

Semiconductor device having tab-leads and a fabrication method thereof

Semiconductor device, method of manufacturing the semiconductor dev...

Method of fabricating a semiconductor device

Semiconductor device having tab leads

Method of producing a semicondutor device having a lead portion wit...

Semiconductor device having a plurality of chips

Semiconductor device having a plurality of semiconductor chips

Semiconductor device having a plurality of chips

Process of ejecting an encapsulated semiconductor device from a mol...

Patents Applicationslast 30 patents

Semiconductor device, method of manufacturing semiconductor device,...