Masaki Yazaki

Person

Fujimino-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame for mounting LED elements, lead frame with resin, method...
- Patent number 9,899,583
- Issue date Feb 20, 2018
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, method for manufacturing lead frame, semiconductor devi...
- Patent number 9,870,983
- Issue date Jan 16, 2018
- Dai Nippon Printing Co., Ltd.
- Satoshi Shibasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for mounting LED elements, lead frame with resin, method...
- Patent number 9,773,960
- Issue date Sep 26, 2017
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for mounting LED elements, lead frame with resin, method...
- Patent number 9,735,330
- Issue date Aug 15, 2017
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for mounting LED elements, lead frame with resin, method...
- Patent number 9,553,247
- Issue date Jan 24, 2017
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, method for manufacturing lead frame, semiconductor devi...
- Patent number 9,543,169
- Issue date Jan 10, 2017
- Dai Nippon Printing Co., Ltd.
- Satoshi Shibasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for mounting LED elements, lead frame with resin, method...
- Patent number 9,412,923
- Issue date Aug 9, 2016
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- F21 - LIGHTING
Information Patent Grant
Lead frame for mounting LED elements, lead frame with resin, method...
- Patent number 9,362,473
- Issue date Jun 7, 2016
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- F21 - LIGHTING
Information Patent Grant
Lead frame, method for manufacturing lead frame, semiconductor devi...
- Patent number 9,257,306
- Issue date Feb 9, 2016
- Dai Nippon Printing Co., Ltd.
- Satoshi Shibasaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Lead frame for mounting LED elements, lead frame with resin, method...
- Patent number 9,214,414
- Issue date Dec 15, 2015
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- F21 - LIGHTING
Information Patent Grant
Lead frame for mounting LED elements, lead frame with resin, method...
- Patent number 9,159,655
- Issue date Oct 13, 2015
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- F21 - LIGHTING
Information Patent Grant
Lead frame for mounting LED elements, lead frame with resin, method...
- Patent number 8,933,548
- Issue date Jan 13, 2015
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...
- Publication number 20170092830
- Publication date Mar 30, 2017
- DAI NIPPON PRINTING CO., LTD.
- Kazunori ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...
- Publication number 20170077011
- Publication date Mar 16, 2017
- DAI NIPPON PRINTING CO., LTD.
- Satoshi SHIBASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...
- Publication number 20160293817
- Publication date Oct 6, 2016
- DAI NIPPON PRINTING CO., LTD.
- Kazunori ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...
- Publication number 20160189978
- Publication date Jun 30, 2016
- DAI NIPPON PRINTING CO., LTD.
- Satoshi SHIBASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...
- Publication number 20160079504
- Publication date Mar 17, 2016
- DAI NIPPON PRINTING CO., LTD.
- Kazunori ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...
- Publication number 20150372210
- Publication date Dec 24, 2015
- DAI NIPPON PRINTING CO., LTD.
- Kazunori ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...
- Publication number 20150349227
- Publication date Dec 3, 2015
- DAI NIPPON PRINTING CO., LTD.
- Kazunori Oda
- F21 - LIGHTING
Information Patent Application
LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...
- Publication number 20150084177
- Publication date Mar 26, 2015
- DAI NIPPON PRINTING CO., LTD.
- Kazunori ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...
- Publication number 20140349424
- Publication date Nov 27, 2014
- Kazunori ODA
- F21 - LIGHTING
Information Patent Application
LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...
- Publication number 20140319663
- Publication date Oct 30, 2014
- Satoshi SHIBASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...
- Publication number 20130221509
- Publication date Aug 29, 2013
- DAI NIPPON PRINTING CO., LTD.
- Kazunori Oda
- F21 - LIGHTING

Masaki Yazaki

Person

Patents Grantslast 30 patents

Lead frame for mounting LED elements, lead frame with resin, method...

Lead frame, method for manufacturing lead frame, semiconductor devi...

Lead frame for mounting LED elements, lead frame with resin, method...

Lead frame for mounting LED elements, lead frame with resin, method...

Lead frame for mounting LED elements, lead frame with resin, method...

Lead frame, method for manufacturing lead frame, semiconductor devi...

Lead frame for mounting LED elements, lead frame with resin, method...

Lead frame for mounting LED elements, lead frame with resin, method...

Lead frame, method for manufacturing lead frame, semiconductor devi...

Lead frame for mounting LED elements, lead frame with resin, method...

Lead frame for mounting LED elements, lead frame with resin, method...

Lead frame for mounting LED elements, lead frame with resin, method...

Patents Applicationslast 30 patents

LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...

LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...

LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...

LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...

LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...

LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...

LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...

LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...

LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...

LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...

LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD...