Masaki Yoshida

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Niigata-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of preparing a sealed light-emitting diode chip
- Patent number 7,932,108
- Issue date Apr 26, 2011
- Namics Corporation
- Toshiaki Yamada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING S...
- Publication number 20240360310
- Publication date Oct 31, 2024
- NAMICS CORPORATION
- Hirotatsu IKARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20200058577
- Publication date Feb 20, 2020
- Namics Corporation
- Masaki YOSHIDA
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND UNCURED FILM COMPRISING THE SAME
- Publication number 20090239992
- Publication date Sep 24, 2009
- Toshiaki Yamada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method of preparing a sealed light-emitting diode chip
- Publication number 20090020779
- Publication date Jan 22, 2009
- NAMICS CORPORATION
- Toshiaki Yamada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Epoxy Resin Composition
- Publication number 20080020231
- Publication date Jan 24, 2008
- Toshiaki Yamada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...