Masako Watanabe

Person

Oita-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating flip-attached and underfilled semiconductor...
- Patent number 8,598,029
- Issue date Dec 3, 2013
- Texas Instruments Incorporated
- Masako Watanabe
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for fabricating flip-attached and underfilled semiconductor...
- Patent number 8,193,085
- Issue date Jun 5, 2012
- Texas Instruments Incorporated
- Masako Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating flip-attached and underfilled semiconductor...
- Patent number 7,701,071
- Issue date Apr 20, 2010
- Texas Instruments Incorporated
- Masako Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder
- Patent number 7,282,175
- Issue date Oct 16, 2007
- Senju Metal Industry Co., Ltd.
- Masazumi Amagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy
- Patent number 7,029,542
- Issue date Apr 18, 2006
- Senju Metal Industry Co., Ltd.
- Masazumi Amagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method
- Patent number 6,887,778
- Issue date May 3, 2005
- Texas Instruments Incorporated
- Masako Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly of semiconductor device and wiring substrate
- Patent number 6,762,506
- Issue date Jul 13, 2004
- Texas Instruments Incorporated
- Masazumi Amagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for Fabricating Flip-Attached and Underfilled Semiconductor...
- Publication number 20120220080
- Publication date Aug 30, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Masako Watanabe
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Method for Fabricating Flip-Attached and Underfilled Semiconductor...
- Publication number 20100144098
- Publication date Jun 10, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Masako WATANABE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
COMPOSITE TYPE SEMICONDUCTOR DEVICE SPACER SHEET, SEMICONDUCTOR PAC...
- Publication number 20100090323
- Publication date Apr 15, 2010
- Lintec Corporation
- Tomonori Shinoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND SPACER SH...
- Publication number 20100025837
- Publication date Feb 4, 2010
- LINTEC CORPORATION
- Tomonori Shinoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Control of Standoff Height Between Packages with a Solder-Embedded...
- Publication number 20080157353
- Publication date Jul 3, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Masako Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Lead-Free Solder
- Publication number 20070243098
- Publication date Oct 18, 2007
- Tsukasa Ohnishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip-attached and underfilled stacked semiconductor devices
- Publication number 20070170599
- Publication date Jul 26, 2007
- Masazumi Amagai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for fabricating flip-attached an underfilled semiconductor d...
- Publication number 20060214314
- Publication date Sep 28, 2006
- Masako Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Lead-free solder alloy
- Publication number 20050036902
- Publication date Feb 17, 2005
- Masazumi Amagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-free solder
- Publication number 20040262779
- Publication date Dec 30, 2004
- Masazumi Amagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Assembly of semiconductor device and wiring substrate
- Publication number 20030173587
- Publication date Sep 18, 2003
- Masazumi Amagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and mounting method
- Publication number 20030132520
- Publication date Jul 17, 2003
- Masako Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and manufacturing method
- Publication number 20030068847
- Publication date Apr 10, 2003
- Masako Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Masako Watanabe

Person

Patents Grantslast 30 patents

Method for fabricating flip-attached and underfilled semiconductor...

Method for fabricating flip-attached and underfilled semiconductor...

Method for fabricating flip-attached and underfilled semiconductor...

Lead-free solder

Lead-free solder alloy

Semiconductor device and manufacturing method

Assembly of semiconductor device and wiring substrate

Patents Applicationslast 30 patents

Method for Fabricating Flip-Attached and Underfilled Semiconductor...

Method for Fabricating Flip-Attached and Underfilled Semiconductor...

COMPOSITE TYPE SEMICONDUCTOR DEVICE SPACER SHEET, SEMICONDUCTOR PAC...

COMPOSITE SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND SPACER SH...

Control of Standoff Height Between Packages with a Solder-Embedded...

Lead-Free Solder

Flip-attached and underfilled stacked semiconductor devices

Method for fabricating flip-attached an underfilled semiconductor d...

Lead-free solder alloy

Lead-free solder

Assembly of semiconductor device and wiring substrate

Semiconductor device and mounting method

Semiconductor device and manufacturing method