Masakuni Shiozawa

Person

Sakata-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component testing device and electronic component transp...
- Patent number 8,816,709
- Issue date Aug 26, 2014
- Seiko Epson Corporation
- Masakuni Shiozawa
- G01 - MEASURING TESTING
Information Patent Grant
Component test apparatus and component transport method
- Patent number 8,558,570
- Issue date Oct 15, 2013
- Seiko Epson Corporation
- Masakuni Shiozawa
- G01 - MEASURING TESTING
Information Patent Grant
Component test apparatus and component transport method
- Patent number 8,008,939
- Issue date Aug 30, 2011
- Seiko Epson Corporation
- Masakuni Shiozawa
- G01 - MEASURING TESTING
Information Patent Grant
Component test apparatus having a pair of rotary transport hands
- Patent number 7,888,928
- Issue date Feb 15, 2011
- Seiko Epson Corporation
- Masakuni Shiozawa
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for manufacturing electronic device, method of manufactur...
- Patent number 7,562,806
- Issue date Jul 21, 2009
- Seiko Epson Corporation
- Masakuni Shiozawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing an electronic device, method of manufac...
- Patent number 7,410,826
- Issue date Aug 12, 2008
- Seiko Epson Corporation
- Masakuni Shiozawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device and method of manufact...
- Patent number 7,371,607
- Issue date May 13, 2008
- Seiko Epson Corporation
- Masakuni Shiozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic device, electronic apparatus, and...
- Patent number 7,256,072
- Issue date Aug 14, 2007
- Seiko Epson Corporation
- Masakuni Shiozawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective packaging of tested semiconductor devices
- Patent number 7,195,935
- Issue date Mar 27, 2007
- Seiko Epson Corporation
- Masakuni Shiozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing an electronic device, method of manufac...
- Patent number 7,017,636
- Issue date Mar 28, 2006
- Seiko Epson Corporation
- Masakuni Shiozawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing electronic device, method of manufactur...
- Patent number 6,984,125
- Issue date Jan 10, 2006
- Seiko Epson Corporation
- Masakuni Shiozawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adsorbing device, sucker and mounting device for conductive member,...
- Patent number 6,638,785
- Issue date Oct 28, 2003
- Seiko Epson Corporation
- Masakuni Shiozawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect substrate, apparatus of applying adhesive material, se...
- Patent number 6,566,763
- Issue date May 20, 2003
- Seiko Epson Corporation
- Masakuni Shiozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adsorbing device, sucker and mounting device for conductive member,...
- Patent number 6,512,294
- Issue date Jan 28, 2003
- Seiko Epson Corporation
- Masakuni Shiozawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive material applying method and apparatus, interconnect subst...
- Patent number 6,391,686
- Issue date May 21, 2002
- Seiko Epson Corporation
- Masakuni Shiozawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DRIVE DEVICE, ELECTRONIC COMPONENT CARRYING DEVICE, ELECTRONIC COMP...
- Publication number 20140352459
- Publication date Dec 4, 2014
- SEIKO EPSON CORPORATION
- Akira Matsuzawa
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
HANDLER AND TEST APPARATUS
- Publication number 20130181576
- Publication date Jul 18, 2013
- SEIKO EPSON CORPORATION
- Masakuni SHIOZAWA
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT CARRYING DEVICE AND ELECTRONIC COMPONENT CARRY...
- Publication number 20130027542
- Publication date Jan 31, 2013
- SEIKO EPSON CORPORATION
- Masakuni SHIOZAWA
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT TESTING DEVICE AND ELECTRONIC COMPONENT TRANSP...
- Publication number 20110279136
- Publication date Nov 17, 2011
- SEIKO EPSON CORPORATION
- Masakuni SHIOZAWA
- G01 - MEASURING TESTING
Information Patent Application
COMPONENT TEST APPARATUS AND COMPONENT TRANSPORT METHOD
- Publication number 20110268538
- Publication date Nov 3, 2011
- SEIKO EPSON CORPORATION
- Masakuni SHIOZAWA
- G01 - MEASURING TESTING
Information Patent Application
COMPONENT TEST APPARATUS AND COMPONENT TRANSPORT METHOD
- Publication number 20090232626
- Publication date Sep 17, 2009
- SEIKO EPSON CORPORATION
- Masakuni SHIOZAWA
- G01 - MEASURING TESTING
Information Patent Application
COMPONENT TEST APPARATUS
- Publication number 20090201040
- Publication date Aug 13, 2009
- SEIKO EPSON CORPORATION
- Masakuni SHIOZAWA
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device, electronic device, electronic apparatus, and...
- Publication number 20070252285
- Publication date Nov 1, 2007
- Masakuni Shiozawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device, electronic device, electronic apparatus, and...
- Publication number 20060125096
- Publication date Jun 15, 2006
- Masakuni Shiozawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor devices and method for manufacturing the same, semico...
- Publication number 20050263759
- Publication date Dec 1, 2005
- Seiko Epson Corporation
- Masakuni Shiozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, electronic device, electronic apparatus, and...
- Publication number 20050184379
- Publication date Aug 25, 2005
- Masakuni Shiozawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and method of manufacturing the same, circuit...
- Publication number 20050098869
- Publication date May 12, 2005
- SEIKO EPSON CORPORATION
- Masakuni Shiozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device and method of manufact...
- Publication number 20050003587
- Publication date Jan 6, 2005
- Seiko Epson Corporation
- Masakuni Shiozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, electronic device, electronic apparatus, and...
- Publication number 20040238948
- Publication date Dec 2, 2004
- Masakuni Shiozawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Adsorbing device, sucker and mounting device for conductive member,...
- Publication number 20030080424
- Publication date May 1, 2003
- SEIKO EPSON CORPORATION
- Masakuni Shiozawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive material applying method and semiconductor device manufact...
- Publication number 20020074617
- Publication date Jun 20, 2002
- SEIKO EPSON CORPORATION
- Masakuni Shiozawa
- H01 - BASIC ELECTRIC ELEMENTS

Masakuni Shiozawa

Person

Patents Grantslast 30 patents

Electronic component testing device and electronic component transp...

Component test apparatus and component transport method

Component test apparatus and component transport method

Component test apparatus having a pair of rotary transport hands

Apparatus for manufacturing electronic device, method of manufactur...

Apparatus for manufacturing an electronic device, method of manufac...

Method of manufacturing semiconductor device and method of manufact...

Semiconductor device, electronic device, electronic apparatus, and...

Selective packaging of tested semiconductor devices

Apparatus for manufacturing an electronic device, method of manufac...

Apparatus for manufacturing electronic device, method of manufactur...

Adsorbing device, sucker and mounting device for conductive member,...

Interconnect substrate, apparatus of applying adhesive material, se...

Adsorbing device, sucker and mounting device for conductive member,...

Adhesive material applying method and apparatus, interconnect subst...

Patents Applicationslast 30 patents

DRIVE DEVICE, ELECTRONIC COMPONENT CARRYING DEVICE, ELECTRONIC COMP...

HANDLER AND TEST APPARATUS

ELECTRONIC COMPONENT CARRYING DEVICE AND ELECTRONIC COMPONENT CARRY...

ELECTRONIC COMPONENT TESTING DEVICE AND ELECTRONIC COMPONENT TRANSP...

COMPONENT TEST APPARATUS AND COMPONENT TRANSPORT METHOD

COMPONENT TEST APPARATUS AND COMPONENT TRANSPORT METHOD

COMPONENT TEST APPARATUS

Semiconductor device, electronic device, electronic apparatus, and...

Semiconductor device, electronic device, electronic apparatus, and...

Semiconductor devices and method for manufacturing the same, semico...

Semiconductor device, electronic device, electronic apparatus, and...

Semiconductor device and method of manufacturing the same, circuit...

Method of manufacturing semiconductor device and method of manufact...

Semiconductor device, electronic device, electronic apparatus, and...

Adsorbing device, sucker and mounting device for conductive member,...

Adhesive material applying method and semiconductor device manufact...