Masakuni Tokita

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Nagano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Work arrangement apparatus
- Patent number 6,966,742
- Issue date Nov 22, 2005
- Shinko Electric Industries Co., Ltd.
- Masakuni Tokita
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Wiring board having vias
- Patent number 6,271,483
- Issue date Aug 7, 2001
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier frame used for circuit boards
- Patent number 5,918,746
- Issue date Jul 6, 1999
- Shinko Electric Industries Co., Ltd.
- Masakuni Tokita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing one side resin sealing type semiconductor d...
- Patent number 5,732,465
- Issue date Mar 31, 1998
- Shinko Electric Industries Co., Ltd.
- Masakuni Tokita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a multi-layer lead frame
- Patent number RE35353
- Issue date Oct 22, 1996
- Shinko Electric Ind. Co, Ltd.
- Masakuni Tokita
- 029 - Metal working
Information Patent Grant
Process for manufacturing a multi-layer lead frame
- Patent number 5,231,756
- Issue date Aug 3, 1993
- Shinko Electric Industries Co., Ltd.
- Masakuni Tokita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Work arrangement apparatus
- Publication number 20040105749
- Publication date Jun 3, 2004
- Shinko Electric Industries Co., Ltd.
- Masakuni Tokita
- H01 - BASIC ELECTRIC ELEMENTS