TREA

Masami Aihara

Follow

Person

  • Kakogawa-shi, JP
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding method and structure
    • Patent number 11,676,935
    • Issue date Jun 13, 2023
    • Waseda University
    • Jun Mizuno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Solder bonding structure and soldering flux
    • Patent number 8,679,263
    • Issue date Mar 25, 2014
    • Harima Chemicals, Inc.
    • Masami Aihara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Soldering flux
    • Patent number 5,907,007
    • Issue date May 25, 1999
    • Denso Corporation
    • Naoki Ito
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Soldering flux composition
    • Patent number 5,211,763
    • Issue date May 18, 1993
    • Nippondenso Co., Ltd.
    • Masanori Takemoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Soldering flux
    • Patent number 5,167,729
    • Issue date Dec 1, 1992
    • Nippondenso Co., Ltd.
    • Masanori Takemoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents