Masami Iwasaki

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Crimp-type semiconductor device having non-alloy structure
- Patent number 4,996,586
- Issue date Feb 26, 1991
- Kabushiki Kaisha Toshiba
- Hideo Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-contact flat type semiconductor device
- Patent number 4,958,215
- Issue date Sep 18, 1990
- Kabushiki Kaisha Toshiba
- Shinjiro Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-packed semiconductor device
- Patent number 4,694,322
- Issue date Sep 15, 1987
- Kabushiki Kaisha Toshiba
- Hiroshi Sakurai
- H01 - BASIC ELECTRIC ELEMENTS