Masami Nakano

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Vancouver, WA, US

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Patents Grantslast 30 patents

Information Patent Grant
System for reducing wafer contamination using freshly, conditioned...
- Patent number 6,503,363
- Issue date Jan 7, 2003
- SEH America, Inc.
- Masami Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of purifying alkaline solution and method of etching semicon...
- Patent number 6,110,839
- Issue date Aug 29, 2000
- Shin-Etsu Handotai Co., Ltd.
- Masami Nakano
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method of drying semiconductor wafers using hot deionized water and...
- Patent number 5,983,907
- Issue date Nov 16, 1999
- SEH America, Inc.
- Jaclyn N. Danh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of edge stain in silicon wafers by ozone dipping
- Patent number 5,972,802
- Issue date Oct 26, 1999
- SEH America, Inc.
- Masami Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of polishing semiconductor wafers
- Patent number 5,951,374
- Issue date Sep 14, 1999
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Prevention of edge stain in silicon wafers by oxygen annealing
- Patent number 5,893,982
- Issue date Apr 13, 1999
- SEH America, Inc.
- Masami Nakano
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method of inspecting particles on wafers
- Patent number 5,640,238
- Issue date Jun 17, 1997
- Shin-Etsu Handotai Co., Ltd.
- Masami Nakano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
System for reducing wafer contamination
- Publication number 20020053402
- Publication date May 9, 2002
- Masami Nakano
- H01 - BASIC ELECTRIC ELEMENTS