Masamichi Ishihara

Person

Kitakyushu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and process for fabricating the same
- Patent number 11,127,657
- Issue date Sep 21, 2021
- Lapis Semiconductor Co., Ltd.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-size, double side connection package and method for manufactur...
- Patent number 10,748,840
- Issue date Aug 18, 2020
- Invensas Corporation
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabricating the same
- Patent number 10,559,521
- Issue date Feb 11, 2020
- Lapis Semiconductor Co., Ltd.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabricating the same
- Patent number 10,199,310
- Issue date Feb 5, 2019
- Lapis Semiconductor Co., Ltd.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-size, double side connection package and method for manufactur...
- Patent number 9,984,961
- Issue date May 29, 2018
- Invensas Corporation
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabricating the same
- Patent number 9,887,147
- Issue date Feb 6, 2018
- Lapis Semiconductor Co., Ltd.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED illumination module and LED illumination apparatus
- Patent number 9,698,327
- Issue date Jul 4, 2017
- SHIKOKU INSTRUMENTATION CO., LTD.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabricating the same
- Patent number 9,559,041
- Issue date Jan 31, 2017
- Lapis Semiconductor Co., Ltd.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and fabrication method for same
- Patent number 9,252,125
- Issue date Feb 2, 2016
- PS4 Luxco S.A.R.L.
- Yutaka Kagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabricating the same
- Patent number 9,093,431
- Issue date Jul 28, 2015
- Lapis Semiconductor Co., Ltd.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink package and method of manufacturing
- Patent number 8,988,882
- Issue date Mar 24, 2015
- Molex Japan Co., Ltd.
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect-use electronic component and method for producing same
- Patent number 8,952,261
- Issue date Feb 10, 2015
- Kyushu Institute of Technology
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabricating the same
- Patent number 8,664,666
- Issue date Mar 4, 2014
- Oki Semiconductor Co., Ltd.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip-size double side connection package
- Patent number 8,557,700
- Issue date Oct 15, 2013
- Invensas Corporation
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-faced electrode package, and its manufacturing method
- Patent number 8,501,542
- Issue date Aug 6, 2013
- Oki Semiconductor Co., Ltd.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensionally integrated semicondutor device and method for m...
- Patent number 8,415,789
- Issue date Apr 9, 2013
- Kyushu Institute of Technology
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component used for wiring and method for manufacturing t...
- Patent number 8,399,980
- Issue date Mar 19, 2013
- Kyushu Institute of Technology
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and fabrication method for same
- Patent number 8,247,896
- Issue date Aug 21, 2012
- Elpida Memory, Inc.
- Yutaka Kagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-faced electrode package and its manufacturing method
- Patent number 8,154,110
- Issue date Apr 10, 2012
- Oki Semiconductor Co., Ltd.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package with post electrodes
- Patent number 8,110,911
- Issue date Feb 7, 2012
- Kyushu Institute of Technology
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device with electrode for ext...
- Patent number 8,017,452
- Issue date Sep 13, 2011
- Kyushu Institute of Technology
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabricating the same
- Patent number 7,944,058
- Issue date May 17, 2011
- Oki Semiconductor Co., Ltd.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with double-sided electrode structure and its...
- Patent number 7,884,466
- Issue date Feb 8, 2011
- Oki Electric Industry Co., Ltd.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and method of manufacturing the packa...
- Patent number 7,838,983
- Issue date Nov 23, 2010
- Kyushu Institute of Technology
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing copper surface, method for forming copper pat...
- Patent number 7,825,026
- Issue date Nov 2, 2010
- Kyushu Institute of Technology
- Akira Izumi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stacked semiconductor device
- Patent number 7,808,093
- Issue date Oct 5, 2010
- Elpida Memory, Inc.
- Yutaka Kagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged stacked semiconductor device and method for manufacturing...
- Patent number 7,576,413
- Issue date Aug 18, 2009
- Kyushu Institute of Technology
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME
- Publication number 20200161223
- Publication date May 21, 2020
- LAPIS SEMICONDUCTOR CO., LTD.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME
- Publication number 20190122961
- Publication date Apr 25, 2019
- LAPIS SEMICONDUCTOR CO., LTD.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SIZE, DOUBLE SIDE CONNECTION PACKAGE AND METHOD FOR MANUFACTUR...
- Publication number 20180269141
- Publication date Sep 20, 2018
- Invensas Corporation
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME
- Publication number 20180122722
- Publication date May 3, 2018
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-size, double side connection package and method for manufactur...
- Publication number 20170162491
- Publication date Jun 8, 2017
- Invensas Corporation
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME
- Publication number 20170103938
- Publication date Apr 13, 2017
- LAPIS SEMICONDUCTOR CO., LTD.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME
- Publication number 20150287663
- Publication date Oct 8, 2015
- LAPIS SEMICONDUCTOR CO., LTD.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED ILLUMINATION MODULE AND LED ILLUMINATION APPARATUS
- Publication number 20150155459
- Publication date Jun 4, 2015
- SHIKOKU INSTRUMENTATION CO., LTD.
- Masamichi Ishihara
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR SAME
- Publication number 20140327024
- Publication date Nov 6, 2014
- STEQ INC.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME
- Publication number 20140131891
- Publication date May 15, 2014
- LAPIS SEMICONDUCTOR CO., LTD.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-size, double side connection package and method for manufactur...
- Publication number 20140091459
- Publication date Apr 3, 2014
- Invensas Corporation
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR SAME
- Publication number 20130001755
- Publication date Jan 3, 2013
- Elpida Memory, Inc.
- Yutaka KAGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT-USE ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME
- Publication number 20120261169
- Publication date Oct 18, 2012
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-FACED ELECTRODE PACKAGE, AND ITS MANUFACTURING METHOD
- Publication number 20120164790
- Publication date Jun 28, 2012
- Okisemiconductor Co., Ltd.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK PACKAGE AND METHOD OF MANUFACTURING
- Publication number 20120127667
- Publication date May 24, 2012
- Kagoshima University
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME
- Publication number 20110201178
- Publication date Aug 18, 2011
- OKI SEMICONDUCTOR CO., LTD.
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DOUBLE-SIDED ELECTRODE STRUCTURE AND ITS...
- Publication number 20110089551
- Publication date Apr 21, 2011
- Oki Electric Industry Co., Ltd.
- Masamichi ISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONALLY INTEGRATED SEMICONDUTOR DEVICE AND METHOD FOR M...
- Publication number 20110062584
- Publication date Mar 17, 2011
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SIZE DOUBLE SIDE CONNECTION PACKAGE AND METHOD FOR MANUFACTURI...
- Publication number 20110057325
- Publication date Mar 10, 2011
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT USED FOR WIRING AND METHOD FOR MANUFACTURING T...
- Publication number 20110012269
- Publication date Jan 20, 2011
- KYUSHU INSTITUTE OF TECHNOLOGY
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR SAME
- Publication number 20110001235
- Publication date Jan 6, 2011
- Elpida Memory, Inc.
- Yutaka KAGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20100295178
- Publication date Nov 25, 2010
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-FACED ELECTRODE PACKAGE AND ITS MANUFACTURING METHOD
- Publication number 20090224381
- Publication date Sep 10, 2009
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090140364
- Publication date Jun 4, 2009
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DOUBLE-SIDED ELECTRODE STRUCTURE AND ITS...
- Publication number 20090072381
- Publication date Mar 19, 2009
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH ELECTRODE FOR EXT...
- Publication number 20090050994
- Publication date Feb 26, 2009
- KYUSHU INSTITUTE OF TECHNOLOGY
- Masamichi ISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device an Process for Fabricating the Same
- Publication number 20080265430
- Publication date Oct 30, 2008
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Music Generation Function, and Mobile E...
- Publication number 20080223196
- Publication date Sep 18, 2008
- Shunsuke Nakamura
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Packaged Stacked Semiconductor Device And Method For Manufacturing...
- Publication number 20080061402
- Publication date Mar 13, 2008
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR SAME
- Publication number 20070241437
- Publication date Oct 18, 2007
- Elpida Memory, Inc.
- Yutaka Kagaya
- H01 - BASIC ELECTRIC ELEMENTS

Masamichi Ishihara

Person

Patents Grantslast 30 patents

Semiconductor device and process for fabricating the same

Chip-size, double side connection package and method for manufactur...

Semiconductor device and process for fabricating the same

Semiconductor device and process for fabricating the same

Chip-size, double side connection package and method for manufactur...

Semiconductor device and process for fabricating the same

LED illumination module and LED illumination apparatus

Semiconductor device and process for fabricating the same

Stacked semiconductor device and fabrication method for same

Semiconductor device and process for fabricating the same

Heat sink package and method of manufacturing

Interconnect-use electronic component and method for producing same

Semiconductor device and process for fabricating the same

Method for manufacturing a chip-size double side connection package

Double-faced electrode package, and its manufacturing method

Three-dimensionally integrated semicondutor device and method for m...

Electronic component used for wiring and method for manufacturing t...

Stacked semiconductor device and fabrication method for same

Double-faced electrode package and its manufacturing method

Semiconductor chip package with post electrodes

Method of manufacturing semiconductor device with electrode for ext...

Semiconductor device and process for fabricating the same

Semiconductor device with double-sided electrode structure and its...

Packaged semiconductor device and method of manufacturing the packa...

Method for processing copper surface, method for forming copper pat...

Stacked semiconductor device

Packaged stacked semiconductor device and method for manufacturing...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME

CHIP-SIZE, DOUBLE SIDE CONNECTION PACKAGE AND METHOD FOR MANUFACTUR...

SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME

Chip-size, double side connection package and method for manufactur...

SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME

LED ILLUMINATION MODULE AND LED ILLUMINATION APPARATUS

SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR SAME

SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME

Chip-size, double side connection package and method for manufactur...

STACKED SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR SAME

INTERCONNECT-USE ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME

DOUBLE-FACED ELECTRODE PACKAGE, AND ITS MANUFACTURING METHOD

HEAT SINK PACKAGE AND METHOD OF MANUFACTURING

SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE WITH DOUBLE-SIDED ELECTRODE STRUCTURE AND ITS...

THREE-DIMENSIONALLY INTEGRATED SEMICONDUTOR DEVICE AND METHOD FOR M...

CHIP-SIZE DOUBLE SIDE CONNECTION PACKAGE AND METHOD FOR MANUFACTURI...

ELECTRONIC COMPONENT USED FOR WIRING AND METHOD FOR MANUFACTURING T...

STACKED SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR SAME

SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

DOUBLE-FACED ELECTRODE PACKAGE AND ITS MANUFACTURING METHOD

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH DOUBLE-SIDED ELECTRODE STRUCTURE AND ITS...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH ELECTRODE FOR EXT...

Semiconductor Device an Process for Fabricating the Same

Semiconductor Device Having Music Generation Function, and Mobile E...

Packaged Stacked Semiconductor Device And Method For Manufacturing...

STACKED SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR SAME