Masamichi Yamada

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Ageo-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Copper foil for printed-wiring board and copper-clad laminate using...
- Patent number 6,989,199
- Issue date Jan 24, 2006
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Printed wiring board-use copper foil and copper clad laminated shee...
- Publication number 20040053019
- Publication date Mar 18, 2004
- Takuya Yamamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR