Masamitsu IKUMO

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 8,420,522
- Issue date Apr 16, 2013
- Fujitsu Semiconductor Limited
- Masamitsu Ikumo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having electrode for...
- Patent number 8,093,148
- Issue date Jan 10, 2012
- Fujitsu Semiconductor Limited
- Yutaka Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board and its manufacturing method
- Patent number 7,915,538
- Issue date Mar 29, 2011
- Fujitsu Semiconductor Limited
- Masamitsu Ikumo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 7,417,326
- Issue date Aug 26, 2008
- Fujitsu Limited
- Masamitsu Ikumo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board and its manufacturing method
- Patent number 7,355,124
- Issue date Apr 8, 2008
- Fujitsu Limited
- Masamitsu Ikumo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,247,950
- Issue date Jul 24, 2007
- Fujitsu Limited
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with read out prevention and method of produci...
- Patent number 7,233,076
- Issue date Jun 19, 2007
- Fujitsu Limited
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 7,064,436
- Issue date Jun 20, 2006
- Fujitsu Limited
- Masahiko Ishiguri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device configured to be surface mountable
- Patent number 6,836,025
- Issue date Dec 28, 2004
- Fujitsu Limited
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
External connection terminal and semiconductor device
- Patent number 6,784,543
- Issue date Aug 31, 2004
- Fujitsu Limited
- Hirohisa Matsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,734,042
- Issue date May 11, 2004
- Fujitsu Limited
- Masamitsu Ikumo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting substrate and mounting method for semiconductor device
- Patent number 6,600,217
- Issue date Jul 29, 2003
- Fujitsu Limited
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
External connection terminal and semiconductor device
- Patent number 6,548,898
- Issue date Apr 15, 2003
- Fujitsu Limited
- Hirohisa Matsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level semiconductor device and method of manufacturing the same
- Patent number 6,515,347
- Issue date Feb 4, 2003
- Fujitsu Limited
- Yasuhiro Shinma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having improved electrical characteristics and...
- Patent number 6,437,432
- Issue date Aug 20, 2002
- Fujitsu Limited
- Masamitsu Ikumo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fixing a semiconductor device having stud bumps to a sub...
- Patent number 6,420,213
- Issue date Jul 16, 2002
- Fujitsu Limited
- Shinsuke Nakajyo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120129335
- Publication date May 24, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Masamitsu IKUMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING ELECTRODE FOR...
- Publication number 20100081269
- Publication date Apr 1, 2010
- Fujitsu Microelectronics Limited
- Yutaka Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20080293234
- Publication date Nov 27, 2008
- FUJITSU LIMITED
- Masamitsu Ikumo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD AND ITS MANUFACTURING METHOD
- Publication number 20080124529
- Publication date May 29, 2008
- Fujitsu Limited
- Masamitsu Ikumo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20070138635
- Publication date Jun 21, 2007
- FUJITSU LIMITED
- Masamitsu Ikumo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20060258045
- Publication date Nov 16, 2006
- FUJITSU LIMITED
- Masahiko Ishiguri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer wiring board and its manufacturing method
- Publication number 20060219429
- Publication date Oct 5, 2006
- FUJITSU LIMITED
- Masamitsu Ikumo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and semiconductor-device manufacturing method
- Publication number 20060214296
- Publication date Sep 28, 2006
- FUJITSU LIMITED
- Tadahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and fabrication method thereof
- Publication number 20060175686
- Publication date Aug 10, 2006
- FUJITSU LIMITED
- Koichi Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20060012017
- Publication date Jan 19, 2006
- FUJITSU LIMITED
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of producing the semiconductor device
- Publication number 20050224970
- Publication date Oct 13, 2005
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20050140004
- Publication date Jun 30, 2005
- Masahiko Ishiguri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20050074971
- Publication date Apr 7, 2005
- FUJITSU LIMITED
- Masamitsu Ikumo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030227095
- Publication date Dec 11, 2003
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20030162320
- Publication date Aug 28, 2003
- FUJITSU LIMITED
- Masamitsu Ikumo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
External connection terminal and semiconductor device
- Publication number 20030151141
- Publication date Aug 14, 2003
- FUJITSU LIMITED
- Hirohisa Matsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
External connection terminal and semiconductor device
- Publication number 20020121709
- Publication date Sep 5, 2002
- FUJITSU LIMITED
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having improved electrical characteristic and...
- Publication number 20010023981
- Publication date Sep 27, 2001
- Masamitsu Ikumo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting substrate and mounting method for semiconductor device
- Publication number 20010013641
- Publication date Aug 16, 2001
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS

Masamitsu IKUMO

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method of the same

Method for manufacturing semiconductor device having electrode for...

Multilayer wiring board and its manufacturing method

Semiconductor device and manufacturing method of the same

Multilayer wiring board and its manufacturing method

Semiconductor device and method of manufacturing the same

Semiconductor device with read out prevention and method of produci...

Semiconductor device and method of fabricating the same

Semiconductor device configured to be surface mountable

External connection terminal and semiconductor device

Semiconductor device and method for fabricating the same

Mounting substrate and mounting method for semiconductor device

External connection terminal and semiconductor device

Wafer level semiconductor device and method of manufacturing the same

Semiconductor device having improved electrical characteristics and...

Method for fixing a semiconductor device having stud bumps to a sub...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING ELECTRODE FOR...

Semiconductor device and manufacturing method of the same

MULTILAYER WIRING BOARD AND ITS MANUFACTURING METHOD

Semiconductor device and manufacturing method of the same

Semiconductor device and method of fabricating the same

Multilayer wiring board and its manufacturing method

Semiconductor device and semiconductor-device manufacturing method

Semiconductor device and fabrication method thereof

Semiconductor device and method of manufacturing the same

Semiconductor device and method of producing the semiconductor device

Semiconductor device and method of fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device and manufacturing method thereof

Semiconductor device and method for fabricating the same

External connection terminal and semiconductor device

External connection terminal and semiconductor device

Semiconductor device having improved electrical characteristic and...

Mounting substrate and mounting method for semiconductor device