Masamoto Tanaka

Person

Chiyoda-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Metal joining structure using metal nanoparticles and metal joining...
- Patent number 9,960,140
- Issue date May 1, 2018
- Nippon Steel & Sumitomo Metal Corporation
- Kohei Tatsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal foil for base material and producing method thereof
- Patent number 9,902,134
- Issue date Feb 27, 2018
- Nippon Steel & Sumikin Materials Co., Ltd.
- Takayuki Kobayashi
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Metal tape material and interconnector for solar module current col...
- Patent number 9,382,603
- Issue date Jul 5, 2016
- Nippon Steel & Sumitomo Metal Corporation
- Keiichi Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball and electronic member
- Patent number 9,320,152
- Issue date Apr 19, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Shinichi Terashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal foil for base material
- Patent number 9,296,180
- Issue date Mar 29, 2016
- NIPPON STELL & SUMIKIN MATERIALS CO., LTD.
- Shinichi Terashima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solder ball for semiconductor packaging and electronic member using...
- Patent number 9,024,442
- Issue date May 5, 2015
- Nippon Steel & Sumikin Materials Co., Ltd.
- Shinichi Terashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder bump bonding structure
- Patent number 8,847,390
- Issue date Sep 30, 2014
- Nippon Steel & Sumikin Materials Co., Ltd.
- Eiji Hashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder alloy, solder ball and electronic member, and lead...
- Patent number 8,562,906
- Issue date Oct 22, 2013
- Nippon Steel & Sumikin Materials Co., Ltd.
- Masamoto Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder ball and electronic member having solder bump
- Patent number 8,501,088
- Issue date Aug 6, 2013
- Nippon Steel & Sumikin Materials Co., Ltd.
- Takayuki Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for manufacturing minute metallic sphere
- Patent number 6,926,860
- Issue date Aug 9, 2005
- Nippon Steel Corporation
- Michio Endo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for manufacturing minute metallic sphere
- Patent number 6,676,726
- Issue date Jan 13, 2004
- Nippon Steel Corporation
- Michio Endo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Oxide superconductor and process for preparation thereof
- Patent number 5,308,799
- Issue date May 3, 1994
- Nippon Steel Corporation
- Mitsuru Morita
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
JUNCTION STRUCTURE, METHOD FOR MANUFACTURING JUNCTION STRUCTURE, AN...
- Publication number 20220241903
- Publication date Aug 4, 2022
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Masamoto TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL JOINING STRUCTURE USING METAL NANOPARTICLES AND METAL JOINING...
- Publication number 20160240505
- Publication date Aug 18, 2016
- NIPPON STEEL & SUMITOMO METAL CORPORATION
- Kohei TATSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL AND ELECTRONIC MEMBER
- Publication number 20150146394
- Publication date May 28, 2015
- NIPPON STEEL & SUMKIN MATERIALS CO., LTD.
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
POLYIMIDE LAYER-CONTAINING FLEXIBLE SUBSTRATE, POLYIMIDE LAYER-CONT...
- Publication number 20150136209
- Publication date May 21, 2015
- NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
- Kouichi Hattori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTERCONNECTOR FOR SOLAR CELLS, AND SOLAR CELL MODULE
- Publication number 20140109962
- Publication date Apr 24, 2014
- NIPPON STEEL & SUMITOMO METAL CORPORATION
- Takayuki Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER BUMP BONDING STRUCTURE
- Publication number 20140054766
- Publication date Feb 27, 2014
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Eiji HASHINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOIL FOR BASE MATERIAL AND PRODUCING METHOD THEREOF
- Publication number 20130236734
- Publication date Sep 12, 2013
- Takayuki Kobayashi
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL FOIL FOR BASE MATERIAL
- Publication number 20130236737
- Publication date Sep 12, 2013
- Shinichi Terashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL TAPE MATERIAL AND INTERCONNECTOR FOR SOLAR MODULE CURRENT COL...
- Publication number 20130008692
- Publication date Jan 10, 2013
- Keiichi Kimura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SOLDER BALL FOR SEMICONDUCTOR PACKAGING AND ELECTRONIC MEMBER USING...
- Publication number 20120223430
- Publication date Sep 6, 2012
- Nippon Steel Materials Co., Ltd.
- Shinichi Terashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISI...
- Publication number 20120038042
- Publication date Feb 16, 2012
- NIPPON MICROMETAL CORPORATION
- Tsutomu Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SAW WIRE AND METHOD OF MANUFACTURING SAW WIRE
- Publication number 20110308371
- Publication date Dec 22, 2011
- Nippon Steel Materials Co., Ltd.
- Mitsuru Morita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER, AND LEAD...
- Publication number 20090304545
- Publication date Dec 10, 2009
- Nippon Steel Materials Co., Ltd.
- Masamoto Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER HAVING SOLDER BUMP
- Publication number 20090196789
- Publication date Aug 6, 2009
- Nippon Steel Materials Co., Ltd.
- Takayuki Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for manufacturing minutes metalic sphere
- Publication number 20040035247
- Publication date Feb 26, 2004
- Nippon Steel Corporation
- Michio Endo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for manufacturing minute metallic sphere
- Publication number 20030029273
- Publication date Feb 13, 2003
- Michio Endo
- B22 - CASTING POWDER METALLURGY

Masamoto Tanaka

Person

Patents Grantslast 30 patents

Metal joining structure using metal nanoparticles and metal joining...

Metal foil for base material and producing method thereof

Metal tape material and interconnector for solar module current col...

Solder ball and electronic member

Metal foil for base material

Solder ball for semiconductor packaging and electronic member using...

Lead-free solder bump bonding structure

Lead-free solder alloy, solder ball and electronic member, and lead...

Solder alloy, solder ball and electronic member having solder bump

Method and apparatus for manufacturing minute metallic sphere

Method and apparatus for manufacturing minute metallic sphere

Oxide superconductor and process for preparation thereof

Patents Applicationslast 30 patents

JUNCTION STRUCTURE, METHOD FOR MANUFACTURING JUNCTION STRUCTURE, AN...

METAL JOINING STRUCTURE USING METAL NANOPARTICLES AND METAL JOINING...

SOLDER BALL AND ELECTRONIC MEMBER

POLYIMIDE LAYER-CONTAINING FLEXIBLE SUBSTRATE, POLYIMIDE LAYER-CONT...

INTERCONNECTOR FOR SOLAR CELLS, AND SOLAR CELL MODULE

LEAD-FREE SOLDER BUMP BONDING STRUCTURE

METAL FOIL FOR BASE MATERIAL AND PRODUCING METHOD THEREOF

METAL FOIL FOR BASE MATERIAL

METAL TAPE MATERIAL AND INTERCONNECTOR FOR SOLAR MODULE CURRENT COL...

SOLDER BALL FOR SEMICONDUCTOR PACKAGING AND ELECTRONIC MEMBER USING...

LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISI...

SAW WIRE AND METHOD OF MANUFACTURING SAW WIRE

LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER, AND LEAD...

SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER HAVING SOLDER BUMP

Method and apparatus for manufacturing minutes metalic sphere

Method and apparatus for manufacturing minute metallic sphere