Masanobu Fujii

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Shimodate, JP

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulant of epoxy resin, curing agent, and secondary aminosilane...
- Patent number 7,544,727
- Issue date Jun 9, 2009
- Hitachi Chemical Co., Ltd.
- Ryoichi Ikezawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Encapsulating material and LOC structure semiconductor device using...
- Patent number 6,211,277
- Issue date Apr 3, 2001
- Hitachi Chemical Company, Ltd.
- Tatsuo Kawata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Biphenyl epoxy resin, naphthalene-containing phenolic resin and acc...
- Patent number 6,194,491
- Issue date Feb 27, 2001
- Hitachi Chemical Company, Ltd.
- Masanobu Fujii
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Encapsulating epoxy resin molding material and semiconductor device
- Publication number 20060074150
- Publication date Apr 6, 2006
- Ryoichi Ikezawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy resin molding material for sealing
- Publication number 20030201548
- Publication date Oct 30, 2003
- Ryoichi Ikezawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...