Masanobu IKEDA

Person

Ebina, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,089,162
- Issue date Jan 3, 2012
- Fujitsu Semiconductor Limited
- Kenichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,034,703
- Issue date Oct 11, 2011
- Fujitsu Semiconductor Limited
- Kenichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,692,315
- Issue date Apr 6, 2010
- Fujitsu Microelectronics Limited
- Kenichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multilayer interconnection structure
- Patent number 7,041,586
- Issue date May 9, 2006
- Fujitsu Limited
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure having integral wiring portion and plug portion an...
- Patent number 6,949,828
- Issue date Sep 27, 2005
- Fujitsu Limited
- Masanobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross reference to related application
- Patent number 6,930,045
- Issue date Aug 16, 2005
- Fujitsu Limited
- Masanobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring-inclusive structure and forming method thereof
- Patent number 6,781,237
- Issue date Aug 24, 2004
- Fujitsu Limited
- Masanobu Ikeda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device manufacturing method of forming an etching sto...
- Patent number 6,689,690
- Issue date Feb 10, 2004
- Fujitsu Limited
- Masanobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 6,638,795
- Issue date Oct 28, 2003
- Fujitsu Limited
- Masanobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multilayer interconnection structure
- Patent number 6,417,116
- Issue date Jul 9, 2002
- Fujitsu Limited
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100130004
- Publication date May 27, 2010
- Fujitsu Microelectronics Limited
- Kenichi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090294988
- Publication date Dec 3, 2009
- Fujitsu Microelectronics Limited
- Kenichi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making a semiconductor device with residual amine group f...
- Publication number 20090149031
- Publication date Jun 11, 2009
- Fujitsu Limited
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20050146041
- Publication date Jul 7, 2005
- FUJITSU LIMITED
- Kenichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor device
- Publication number 20040043593
- Publication date Mar 4, 2004
- FUJITSU LIMITED
- Masanobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Organic insulating film forming method, semiconductor device manufa...
- Publication number 20040029401
- Publication date Feb 12, 2004
- FUJITSU LIMITED
- Hiroyasu Matsugai
- G02 - OPTICS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20030227087
- Publication date Dec 11, 2003
- FUJITSU LIMITED
- Katsumi Kakamu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring structure and method of forming the same
- Publication number 20030178727
- Publication date Sep 25, 2003
- Masanobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring-inclusive structure and forming method thereof
- Publication number 20030168743
- Publication date Sep 11, 2003
- FUJITSU LIMITED
- Masanobu Ikeda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor device manufacturing method of forming an etching sto...
- Publication number 20030017698
- Publication date Jan 23, 2003
- FUJITSU LIMITED
- Masanobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20030003617
- Publication date Jan 2, 2003
- FUJITSU LIMITED
- Masanobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a multilayer interconnection structure
- Publication number 20020151190
- Publication date Oct 17, 2002
- FUJITSU LIMITED
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A MULTILAYER INTERCONNECTION STRUCTURE
- Publication number 20010044201
- Publication date Nov 22, 2001
- HIROSHI KUDO
- H01 - BASIC ELECTRIC ELEMENTS

Masanobu IKEDA

Person

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device having a multilayer interconnection structure

Wiring structure having integral wiring portion and plug portion an...

Cross reference to related application

Wiring-inclusive structure and forming method thereof

Semiconductor device manufacturing method of forming an etching sto...

Semiconductor device and method of fabricating the same

Semiconductor device having a multilayer interconnection structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Method of making a semiconductor device with residual amine group f...

Semiconductor device and method for manufacturing the same

Method for fabricating semiconductor device

Organic insulating film forming method, semiconductor device manufa...

Semiconductor device and method of manufacturing the same

Wiring structure and method of forming the same

Wiring-inclusive structure and forming method thereof

Semiconductor device manufacturing method of forming an etching sto...

Semiconductor device and method of fabricating the same

Semiconductor device having a multilayer interconnection structure

SEMICONDUCTOR DEVICE HAVING A MULTILAYER INTERCONNECTION STRUCTURE