Masanori Kawade

Person

Ibi-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive pin attached to package substrate
- Patent number 8,536,696
- Issue date Sep 17, 2013
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead pin for mounting semiconductor and printed wiring board
- Patent number 8,426,748
- Issue date Apr 23, 2013
- Ibiden Co., Ltd.
- Masanori Kawade
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate with a conductive connecting pin
- Patent number 8,110,917
- Issue date Feb 7, 2012
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connecting pin for package substance
- Patent number 8,035,214
- Issue date Oct 11, 2011
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connecting pin and package substrate
- Patent number 7,902,659
- Issue date Mar 8, 2011
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connecting pins for a package substrate
- Patent number 7,847,393
- Issue date Dec 7, 2010
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead pin for mounting semiconductor and printed wiring board
- Patent number 7,723,620
- Issue date May 25, 2010
- Ibiden Co., Ltd.
- Masanori Kawade
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LEAD PIN FOR MOUNTING SEMICONDUCTOR AND PRINTED WIRING BOARD
- Publication number 20100187004
- Publication date Jul 29, 2010
- IBIDEN CO., LTD.
- Masanori KAWADE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE
- Publication number 20100032200
- Publication date Feb 11, 2010
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE
- Publication number 20090314537
- Publication date Dec 24, 2009
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE
- Publication number 20090154131
- Publication date Jun 18, 2009
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE
- Publication number 20090053459
- Publication date Feb 26, 2009
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead Pin for Mounting Semiconductor and Printed Wiring Board
- Publication number 20080055874
- Publication date Mar 6, 2008
- IBIDEN CO., LTD
- Masanori Kawade
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Masanori Kawade

Person

Patents Grantslast 30 patents

Conductive pin attached to package substrate

Lead pin for mounting semiconductor and printed wiring board

Package substrate with a conductive connecting pin

Conductive connecting pin for package substance

Conductive connecting pin and package substrate

Conductive connecting pins for a package substrate

Lead pin for mounting semiconductor and printed wiring board

Patents Applicationslast 30 patents

LEAD PIN FOR MOUNTING SEMICONDUCTOR AND PRINTED WIRING BOARD

CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE

CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE

CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE

CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE

Lead Pin for Mounting Semiconductor and Printed Wiring Board