MASANORI NOMURA

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bidirectional switch module and bidirectional switch
- Patent number 12,125,904
- Issue date Oct 22, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Ichiryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bidirectional switch, electrical device, and multi-level inverter
- Patent number 12,126,274
- Issue date Oct 22, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yusuke Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bidirectional switch element
- Patent number 11,605,715
- Issue date Mar 14, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masanori Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including heat-dissipating metal multilayer ha...
- Patent number 11,257,733
- Issue date Feb 22, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Ichiryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible touch sensor and method of manufacturing the same
- Patent number 10,228,806
- Issue date Mar 12, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihiro Tomita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component package including sealing resin layer, metal m...
- Patent number 10,083,889
- Issue date Sep 25, 2018
- Panasonic Corporation
- Takashi Ichiryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable flexible substrate including first insulating layer, se...
- Patent number 9,860,979
- Issue date Jan 2, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Ichiryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate including stretchable sheet
- Patent number 9,844,133
- Issue date Dec 12, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihiro Tomita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component package including electronic component, metal...
- Patent number 9,812,385
- Issue date Nov 7, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part package
- Patent number 9,373,762
- Issue date Jun 21, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Susumu Sawada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BIDIRECTIONAL SWITCH MODULE AND BIDIRECTIONAL SWITCH
- Publication number 20220310835
- Publication date Sep 29, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Takashi ICHIRYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIDIRECTIONAL SWITCH, ELECTRICAL DEVICE, AND MULTI-LEVEL INVERTER
- Publication number 20210408934
- Publication date Dec 30, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Yusuke KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIDIRECTIONAL SWITCH ELEMENT
- Publication number 20210134963
- Publication date May 6, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Masanori NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200027814
- Publication date Jan 23, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Takashi ICHIRYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE INCLUDING SEALING RESIN LAYER, METAL M...
- Publication number 20170352603
- Publication date Dec 7, 2017
- PANASONIC CORPORATION
- TAKASHI ICHIRYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE TOUCH SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170300147
- Publication date Oct 19, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- Yoshihiro TOMITA
- G01 - MEASURING TESTING
Information Patent Application
FLEXIBLE SUBSTRATE INCLUDING STRETCHABLE SHEET
- Publication number 20170181277
- Publication date Jun 22, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- YOSHIHIRO TOMITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE FLEXIBLE SUBSTRATE INCLUDING FIRST INSULATING LAYER, SE...
- Publication number 20160353567
- Publication date Dec 1, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- TAKASHI ICHIRYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT PACKAGE INCLUDING ELECTRONIC COMPONENT, METAL...
- Publication number 20160351481
- Publication date Dec 1, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- KOJI KAWAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART PACKAGE
- Publication number 20150364661
- Publication date Dec 17, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- SUSUMU SAWADA
- H01 - BASIC ELECTRIC ELEMENTS

MASANORI NOMURA

Person

Patents Grantslast 30 patents

Bidirectional switch module and bidirectional switch

Bidirectional switch, electrical device, and multi-level inverter

Bidirectional switch element

Semiconductor device including heat-dissipating metal multilayer ha...

Flexible touch sensor and method of manufacturing the same

Electronic component package including sealing resin layer, metal m...

Stretchable flexible substrate including first insulating layer, se...

Flexible substrate including stretchable sheet

Electronic component package including electronic component, metal...

Electronic part package

Patents Applicationslast 30 patents

BIDIRECTIONAL SWITCH MODULE AND BIDIRECTIONAL SWITCH

BIDIRECTIONAL SWITCH, ELECTRICAL DEVICE, AND MULTI-LEVEL INVERTER

BIDIRECTIONAL SWITCH ELEMENT

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC COMPONENT PACKAGE INCLUDING SEALING RESIN LAYER, METAL M...

FLEXIBLE TOUCH SENSOR AND METHOD OF MANUFACTURING THE SAME

FLEXIBLE SUBSTRATE INCLUDING STRETCHABLE SHEET

STRETCHABLE FLEXIBLE SUBSTRATE INCLUDING FIRST INSULATING LAYER, SE...

ELECTRONIC COMPONENT PACKAGE INCLUDING ELECTRONIC COMPONENT, METAL...

ELECTRONIC PART PACKAGE