Masanori Onodera

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,018,105
- Issue date May 25, 2021
- Cypress Semiconductor Corporation
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with stacked semiconductor chips
- Patent number 10,347,618
- Issue date Jul 9, 2019
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Camera module and electronic apparatus
- Patent number 10,200,642
- Issue date Feb 5, 2019
- Sony Corporation
- Takahiro Akahane
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,887,178
- Issue date Feb 6, 2018
- Cypress Semiconductor Corporation
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory and devices that use the same
- Patent number 9,837,397
- Issue date Dec 5, 2017
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,508,651
- Issue date Nov 29, 2016
- Cypress Semiconductor Corporation
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making semiconductor device with sealing resin
- Patent number 9,472,540
- Issue date Oct 18, 2016
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structures and methods for stack type semiconductor packaging
- Patent number 9,418,940
- Issue date Aug 16, 2016
- Cypress Semiconductor Corporation
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device used in a stacked-type...
- Patent number 9,368,424
- Issue date Jun 14, 2016
- Cypress Semiconductor Corporation
- Yasuhiro Shinma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a chip mounte...
- Patent number 9,312,252
- Issue date Apr 12, 2016
- Cypress Semiconductor Corporation
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,293,441
- Issue date Mar 22, 2016
- Cypress Semiconductor Corporation
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,245,774
- Issue date Jan 26, 2016
- Cypress Semiconductor Corporation
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure for stacked-type semiconductor device, method of...
- Patent number 9,142,440
- Issue date Sep 22, 2015
- Cypess Semiconductor Corporation
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sealing resin
- Patent number 9,041,177
- Issue date May 26, 2015
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and programming method
- Patent number 8,900,928
- Issue date Dec 2, 2014
- Spansion LLC
- Koji Taya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and programming method
- Patent number 8,772,953
- Issue date Jul 8, 2014
- Spansion LLC
- Koji Taya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Heat dissipation methods and structures for semiconductor device
- Patent number 8,759,157
- Issue date Jun 24, 2014
- Spansion LLC
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having chip mounted on an interposer
- Patent number 8,749,039
- Issue date Jun 10, 2014
- Spansion LLC
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,637,997
- Issue date Jan 28, 2014
- Spansion LLC
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing thereof
- Patent number 8,586,412
- Issue date Nov 19, 2013
- Spansion LLC
- Kouichi Meguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and programming method
- Patent number 8,530,282
- Issue date Sep 10, 2013
- Spansion LLC
- Koji Taya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Heat dissipation methods and structures for semiconductor device
- Patent number 8,531,019
- Issue date Sep 10, 2013
- Spansion LLC
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing thereof
- Patent number 8,492,890
- Issue date Jul 23, 2013
- Spansion LLC
- Kouichi Meguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,466,552
- Issue date Jun 18, 2013
- Spansion LLC
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making a semiconductor device
- Patent number 8,329,562
- Issue date Dec 11, 2012
- Spansion LLC
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 8,330,263
- Issue date Dec 11, 2012
- Spansion LLC
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,030,179
- Issue date Oct 4, 2011
- Spansion, LLC
- Masataka Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 7,968,990
- Issue date Jun 28, 2011
- Spansion LLC
- Junji Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,964,446
- Issue date Jun 21, 2011
- Spansion LLC
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC carrie, IC socket and method for testing IC device
- Patent number 7,884,630
- Issue date Feb 8, 2011
- Micronics Japan Co., Ltd.
- Eichi Osato
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SIGNAL PROCESSOR AND SIGNAL PROCESSING SYSTEM
- Publication number 20240176752
- Publication date May 30, 2024
- ROHM CO., LTD.
- Naoki TADA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200058610
- Publication date Feb 20, 2020
- CYPRESS SEMICONDUCTOR CORPORATION
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE AND ELECTRONIC APPARATUS
- Publication number 20180220088
- Publication date Aug 2, 2018
- TAKAHIRO AKAHANE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE
- Publication number 20180076188
- Publication date Mar 15, 2018
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170092606
- Publication date Mar 30, 2017
- Masanori ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE
- Publication number 20170069614
- Publication date Mar 9, 2017
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160204081
- Publication date Jul 14, 2016
- CYPRESS SEMICONDUCTOR CORPORATION
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE
- Publication number 20150255446
- Publication date Sep 10, 2015
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CHIP MOUNTED ON AN INTERPOSER
- Publication number 20140256088
- Publication date Sep 11, 2014
- SPANSION LLC
- Masanori ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140120662
- Publication date May 1, 2014
- SPANSION LLC
- Masanori ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD
- Publication number 20140035170
- Publication date Feb 6, 2014
- SPANSION LLC
- Koji Taya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
HEAT DISSIPATION METHODS AND STRUCTURES FOR SEMICONDUCTOR DEVICE
- Publication number 20130337612
- Publication date Dec 19, 2013
- SPANSION LLC
- Masanori ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20130288430
- Publication date Oct 31, 2013
- Kouichi MEGURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE
- Publication number 20130100318
- Publication date Apr 25, 2013
- SPANSION LLC
- Masanori ONODERA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120025364
- Publication date Feb 2, 2012
- Masataka HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
- Publication number 20110312108
- Publication date Dec 22, 2011
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
- Publication number 20110309494
- Publication date Dec 22, 2011
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110248400
- Publication date Oct 13, 2011
- Masanori ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD
- Publication number 20110024922
- Publication date Feb 3, 2011
- Koji Taya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
- Publication number 20100102424
- Publication date Apr 29, 2010
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090325346
- Publication date Dec 31, 2009
- Masataka HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD
- Publication number 20090256250
- Publication date Oct 15, 2009
- Koji Taya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
STACKED SOLDER BALLS FOR INTEGRATED CIRCUIT DEVICE PACKAGING AND AS...
- Publication number 20090212423
- Publication date Aug 27, 2009
- Junji TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20090206462
- Publication date Aug 20, 2009
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD
- Publication number 20090174057
- Publication date Jul 9, 2009
- Koji Taya
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20090115070
- Publication date May 7, 2009
- Junji TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR STACK TYPE SEMICONDUCTOR PACKAGING
- Publication number 20090115044
- Publication date May 7, 2009
- Masataka HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Structure for stacked-type semiconductor device, method of...
- Publication number 20090093085
- Publication date Apr 9, 2009
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090072394
- Publication date Mar 19, 2009
- Masanori ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090020885
- Publication date Jan 22, 2009
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS

Masanori Onodera

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing the same

Non-volatile memory with stacked semiconductor chips

Camera module and electronic apparatus

Semiconductor device and method of manufacturing the same

Non-volatile memory and devices that use the same

Semiconductor device and method of manufacturing the same

Methods for making semiconductor device with sealing resin

Structures and methods for stack type semiconductor packaging

Method of fabricating a semiconductor device used in a stacked-type...

Method of manufacturing a semiconductor device having a chip mounte...

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Carrier structure for stacked-type semiconductor device, method of...

Semiconductor device with sealing resin

Semiconductor device and programming method

Semiconductor device and programming method

Heat dissipation methods and structures for semiconductor device

Semiconductor device having chip mounted on an interposer

Semiconductor device and method of manufacturing the same

Semiconductor device and method for manufacturing thereof

Semiconductor device and programming method

Heat dissipation methods and structures for semiconductor device

Semiconductor device and method for manufacturing thereof

Semiconductor device and method of manufacturing the same

Methods of making a semiconductor device

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of fabricating the same

Semiconductor device and method of manufacturing the same

IC carrie, IC socket and method for testing IC device

Patents Applicationslast 30 patents

SIGNAL PROCESSOR AND SIGNAL PROCESSING SYSTEM

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CAMERA MODULE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE

SEMICONDUCTOR DEVICE HAVING CHIP MOUNTED ON AN INTERPOSER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD

HEAT DISSIPATION METHODS AND STRUCTURES FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD

STACKED SOLDER BALLS FOR INTEGRATED CIRCUIT DEVICE PACKAGING AND AS...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

STRUCTURES AND METHODS FOR STACK TYPE SEMICONDUCTOR PACKAGING

Carrier Structure for stacked-type semiconductor device, method of...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method of manufacturing the same