Masao Hayakawa

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a bump electrode
- Patent number 5,310,699
- Issue date May 10, 1994
- Sharp Kabushiki Kaisha
- Yasunori Chikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic encapsulant for semiconductor
- Patent number 4,926,239
- Issue date May 15, 1990
- Sharp Kabushiki Kaisha
- Kazuya Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead electrode connection in a semiconductor device
- Patent number 4,536,786
- Issue date Aug 20, 1985
- Sharp Kabushiki Kaisha
- Masao Hayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a through-hole connector
- Patent number 4,383,363
- Issue date May 17, 1983
- Sharp Kabushiki Kaisha
- Masao Hayakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flat shaped semiconductor encapsulation
- Patent number 4,300,153
- Issue date Nov 10, 1981
- Sharp Kabushiki Kaisha
- Masao Hayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-lead frame member with means for limiting mold spread
- Patent number 4,280,132
- Issue date Jul 21, 1981
- Sharp Kabushiki Kaisha
- Masao Hayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic plate for supporting a semiconductor wafer
- Patent number 4,247,590
- Issue date Jan 27, 1981
- Sharp Kabushiki Kaisha
- Masao Hayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead electrode structure for a semiconductor chip carried on a flex...
- Patent number 4,151,543
- Issue date Apr 24, 1979
- Sharp Kabushiki Kaisha
- Masao Hayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for use in an electronic apparatus having a pl...
- Patent number 4,120,041
- Issue date Oct 10, 1978
- Sharp Kabushiki Kaisha
- Masao Hayakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Masao Hayakawa

Person

Patents Grantslast 30 patents

Method of manufacturing a bump electrode

Plastic encapsulant for semiconductor

Lead electrode connection in a semiconductor device

Method of making a through-hole connector

Flat shaped semiconductor encapsulation

Multi-lead frame member with means for limiting mold spread

Ceramic plate for supporting a semiconductor wafer

Lead electrode structure for a semiconductor chip carried on a flex...

Semiconductor device for use in an electronic apparatus having a pl...