Masao Kanno

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Shimodate, JP

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Patents Grantslast 30 patents

Information Patent Grant
Circuit boards using heat resistant resin for adhesive layers
- Patent number 6,121,553
- Issue date Sep 19, 2000
- Hitachi Chemical Company, Ltd.
- Eiichi Shinada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing printed wiring board
- Patent number 5,309,632
- Issue date May 10, 1994
- Hitachi Chemical Co., Ltd.
- Hiroshi Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing printed wiring boards
- Patent number 5,153,987
- Issue date Oct 13, 1992
- Hitachi Chemical Company, Ltd.
- Hiroshi Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-density wired circuit board using insulated wires
- Patent number 4,791,238
- Issue date Dec 13, 1988
- Hitachi Chemical Company, Ltd.
- Masao Kanno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR