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Masao Nakayama

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  • Osaka, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Lead frame for use with an RF powered semiconductor
    • Patent number 6,208,023
    • Issue date Mar 27, 2001
    • Matsushita Electronics Corporation
    • Masao Nakayama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Copper-tungsten alloys and their manufacturing methods
    • Patent number 5,889,220
    • Issue date Mar 30, 1999
    • Toho Kinzoku Co, Ltd
    • Naoyoshi Akiyoshi
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Grant

    Semiconductor device
    • Patent number D396846
    • Issue date Aug 11, 1998
    • Matsushita Electronics Corporation
    • Masao Nakayama
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Semiconductor device
    • Patent number D396847
    • Issue date Aug 11, 1998
    • Matsushita Electronics Corporation
    • Masao Nakayama
    • D13 - Equipment for production, distribution, or transformation of energy