Masaru HATABE

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Structure including copper plating layer or copper alloy plating layer
- Patent number 11,993,862
- Issue date May 28, 2024
- Ishihara Chemical Co., LTD
- Masaru Hatabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper or copper alloy electroplating bath
- Patent number 11,946,153
- Issue date Apr 2, 2024
- Ishihara Chemical Co., LTD
- Masaru Hatabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin or tin alloy electroplating bath, and electronic component havi...
- Patent number 11,939,691
- Issue date Mar 26, 2024
- Ishihara Chemical Co., LTD
- Syohei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure containing Sn layer or Sn alloy layer
- Patent number 11,052,637
- Issue date Jul 6, 2021
- Ishihara Chemical Co., LTD
- Shoya Iuchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing alloy bump
- Patent number 10,062,657
- Issue date Aug 28, 2018
- Ishihara Chemical Co., Ltd.
- Shoya Iuchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE COMPRISING UNDER BARRIER METAL AND SOLDER LAYER, AND METH...
- Publication number 20240258255
- Publication date Aug 1, 2024
- ISHIHARA CHEMICAL CO., LTD.
- Masaru HATABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENT METHOD AFTER PLATING WITH Sn OR Sn ALLOY
- Publication number 20240052501
- Publication date Feb 15, 2024
- ISHIHARA CHEMICAL CO., LTD.
- Masaru HATABE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRUCTURE CONTAINING Sn LAYER OR Sn ALLOY LAYER
- Publication number 20230072996
- Publication date Mar 9, 2023
- ISHIHARA CHEMICAL CO., LTD.
- Takahiro TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE INCLUDING COPPER PLATING LAYER OR COPPER ALLOY PLATING LAYER
- Publication number 20220316085
- Publication date Oct 6, 2022
- ISHIHARA CHEMICAL CO., LTD.
- Masaru HATABE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER OR COPPER ALLOY ELECTROPLATING BATH
- Publication number 20220127741
- Publication date Apr 28, 2022
- ISHIHARA CHEMICAL CO., LTD.
- Masaru HATABE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
STRUCTURE CONTAINING SN LAYER OR SN ALLOY LAYER
- Publication number 20200376808
- Publication date Dec 3, 2020
- ISHIHARA CHEMICAL CO., LTD.
- Shoya IUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTROLYTIC TIN OR TIN ALLOY PLATING BATH AND ELECTRONIC COMPONENT...
- Publication number 20190368063
- Publication date Dec 5, 2019
- ISHIHARA CHEMICAL CO., LTD.
- Syohei YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ALLOY BUMP
- Publication number 20170330850
- Publication date Nov 16, 2017
- Ishihara Chemical Co., Ltd.
- Shoya IUCHI
- H01 - BASIC ELECTRIC ELEMENTS

Masaru HATABE

Person

Patents Grantslast 30 patents

Structure including copper plating layer or copper alloy plating layer

Copper or copper alloy electroplating bath

Tin or tin alloy electroplating bath, and electronic component havi...

Structure containing Sn layer or Sn alloy layer

Method for manufacturing alloy bump

Patents Applicationslast 30 patents

STRUCTURE COMPRISING UNDER BARRIER METAL AND SOLDER LAYER, AND METH...

TREATMENT METHOD AFTER PLATING WITH Sn OR Sn ALLOY

STRUCTURE CONTAINING Sn LAYER OR Sn ALLOY LAYER

STRUCTURE INCLUDING COPPER PLATING LAYER OR COPPER ALLOY PLATING LAYER

COPPER OR COPPER ALLOY ELECTROPLATING BATH

STRUCTURE CONTAINING SN LAYER OR SN ALLOY LAYER

ELECTROLYTIC TIN OR TIN ALLOY PLATING BATH AND ELECTRONIC COMPONENT...

METHOD FOR MANUFACTURING ALLOY BUMP