Masaru Hirose

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Higashino Minami, JP

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Patents Grantslast 30 patents

Information Patent Grant
Copper foil for printed circuit boards and its surface treatment me...
- Patent number 6,524,723
- Issue date Feb 25, 2003
- Fukuda Metal Foil & Powder Co., Ltd.
- Masaru Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for surface treatment of copper foil
- Patent number 6,419,811
- Issue date Jul 16, 2002
- Fukuda Metal Foil & Powder Co., Ltd.
- Hisanori Manabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Copper foil for printed circuit boards and its surface treatment me...
- Publication number 20020017395
- Publication date Feb 14, 2002
- FUKUDA METAL FOIL & POWDER CO., LTD.
- Masaru Hirose
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for surface treatment of copper foil
- Publication number 20020011418
- Publication date Jan 31, 2002
- FUKUDA METAL FOIL & POWDER CO., LTD.
- Hisanori Manabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR