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Masaru Kusaka

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  • Kitaadachi-gun, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Plating method
    • Patent number 7,374,652
    • Issue date May 20, 2008
    • Rohm and Haas Electronic Materials LLC
    • Shinjiro Hayashi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for electrolytic copper plating
    • Patent number 6,977,035
    • Issue date Dec 20, 2005
    • Shipley Company, L.L.C.
    • Hideki Tsuchida
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electrolytic copper plating method
    • Patent number 6,835,294
    • Issue date Dec 28, 2004
    • Shipley Company, L.L.C.
    • Hideki Tsuchida
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Via filling method
    • Patent number 6,761,814
    • Issue date Jul 13, 2004
    • Shipley Company, L.L.C.
    • Masaru Kusaka
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Plating method
    • Publication number 20070007143
    • Publication date Jan 11, 2007
    • Rohm and Haas Electronic Materials L.L.C.
    • Shinjiro Hayashi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Composite material with improved binding strength and method for fo...
    • Publication number 20050164020
    • Publication date Jul 28, 2005
    • Shipley Company, L.L.C.
    • Masaru Seita
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Method for electrolytic copper plating
    • Publication number 20040217008
    • Publication date Nov 4, 2004
    • Shipley Company, L.L.C.
    • Hideki Tsuchida
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Electroplating method
    • Publication number 20040118691
    • Publication date Jun 24, 2004
    • Shipley Company, L.L.C.
    • Masaru Kusaka
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Process for electrolytic copper plating
    • Publication number 20040089557
    • Publication date May 13, 2004
    • Shipley Company, L.L.C.
    • Hideki Tsuchida
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Composite material with improved binding strength and method for fo...
    • Publication number 20040072015
    • Publication date Apr 15, 2004
    • Shipley Company, L.L.C.
    • Masaru Seita
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Copper electroplating method using insoluble anode
    • Publication number 20040050706
    • Publication date Mar 18, 2004
    • Masaru Seita
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Via filling method
    • Publication number 20030221967
    • Publication date Dec 4, 2003
    • Shipley Company, L.L.C.
    • Hideki Tsuchida
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Via filling method
    • Publication number 20030183526
    • Publication date Oct 2, 2003
    • Shipley Company, L.L.C.
    • Masaru Kusaka
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Electrolytic copper plating method
    • Publication number 20030015433
    • Publication date Jan 23, 2003
    • Shipley Company, L.L.C.
    • Hideki Tsuchida
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR