TREA

Masaru Nakamura

Follow

Person

  • Mitaka, JP
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Method of processing wafer and processing apparatus for wafer
    • Patent number 12,191,204
    • Issue date Jan 7, 2025
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 12,186,857
    • Issue date Jan 7, 2025
    • Disco Corporation
    • Masaru Nakamura
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Processing method of wafer
    • Patent number 12,106,966
    • Issue date Oct 1, 2024
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Laser processing apparatus
    • Patent number 11,978,645
    • Issue date May 7, 2024
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Processing method of wafer
    • Patent number 11,600,513
    • Issue date Mar 7, 2023
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Holding table manufacturing method
    • Patent number 11,583,962
    • Issue date Feb 21, 2023
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Crack detection method
    • Patent number 11,519,865
    • Issue date Dec 6, 2022
    • Disco Corporation
    • Masaru Nakamura
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Processing apparatus
    • Patent number 11,489,299
    • Issue date Nov 1, 2022
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 11,430,696
    • Issue date Aug 30, 2022
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 11,387,133
    • Issue date Jul 12, 2022
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 11,380,550
    • Issue date Jul 5, 2022
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cutting blade shaping method
    • Patent number 11,370,084
    • Issue date Jun 28, 2022
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 11,367,656
    • Issue date Jun 21, 2022
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing apparatus including imager of mark of processed wo...
    • Patent number 11,364,573
    • Issue date Jun 21, 2022
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 11,328,956
    • Issue date May 10, 2022
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 11,322,403
    • Issue date May 3, 2022
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 11,322,404
    • Issue date May 3, 2022
    • Disco Corporation
    • Masaru Nakamura
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Grant

    Laser processing method
    • Patent number 11,285,565
    • Issue date Mar 29, 2022
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laminate processing method
    • Patent number 11,069,543
    • Issue date Jul 20, 2021
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Laminate processing method
    • Patent number 11,056,361
    • Issue date Jul 6, 2021
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer expanding method and wafer expanding apparatus
    • Patent number 11,031,276
    • Issue date Jun 8, 2021
    • Disco Corporation
    • Yoshihiro Kawaguchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer expanding method and wafer expanding apparatus
    • Patent number 11,018,044
    • Issue date May 25, 2021
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Communication device, link-up method, and communication system
    • Patent number 10,797,932
    • Issue date Oct 6, 2020
    • Renesas Electronics Corporation
    • Masaru Nakamura
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Boron neutron capture therapy system
    • Patent number 10,668,153
    • Issue date Jun 2, 2020
    • Fujidenolo Co. Ltd.
    • Tsuyako Takeyoshi
    • A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
  • Information Patent Grant

    Protective tape attaching method
    • Patent number 10,622,230
    • Issue date Apr 14, 2020
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device, selection control system, selection method, and...
    • Patent number 10,574,756
    • Issue date Feb 25, 2020
    • Casio Computer Co., Ltd.
    • Masaru Nakamura
    • A63 - SPORTS GAMES AMUSEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 10,438,898
    • Issue date Oct 8, 2019
    • Disco Corporation
    • Masaru Nakamura
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Magnesium fluoride sintered compact, method for manufacturing magne...
    • Patent number 10,343,951
    • Issue date Jul 9, 2019
    • NIPPON LIGHT METAL COMPANY, LTD.
    • Hidaka Furuya
    • A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
  • Information Patent Grant

    Processing apparatus
    • Patent number 10,079,166
    • Issue date Sep 18, 2018
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Leakage laser beam detecting method
    • Patent number 9,929,105
    • Issue date Mar 27, 2018
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    PROCESSING METHOD OF WAFER
    • Publication number 20240312824
    • Publication date Sep 19, 2024
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HOLDING JIG, MANUFACTURING METHOD OF HOLDING JIG, AND GRINDING METH...
    • Publication number 20240149392
    • Publication date May 9, 2024
    • Disco Corporation
    • Masaru Nakamura
    • B24 - GRINDING POLISHING
  • Information Patent Application

    PROCESSING METHOD OF WAFER
    • Publication number 20240096704
    • Publication date Mar 21, 2024
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP TREATING METHOD
    • Publication number 20240047262
    • Publication date Feb 8, 2024
    • Disco Corporation
    • Masaru Nakamura
    • B24 - GRINDING POLISHING
  • Information Patent Application

    VERIFICATION METHOD FOR DEVICE CHIPS
    • Publication number 20230411181
    • Publication date Dec 21, 2023
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20230298940
    • Publication date Sep 21, 2023
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20230282486
    • Publication date Sep 7, 2023
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHUCK TABLE AND MANUFACTURING METHOD OF CHUCK TABLE
    • Publication number 20230245914
    • Publication date Aug 3, 2023
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHUCK TABLE AND GRINDING APPARATUS
    • Publication number 20230234182
    • Publication date Jul 27, 2023
    • Disco Corporation
    • Masaru Nakamura
    • B24 - GRINDING POLISHING
  • Information Patent Application

    CLEANING ASSEMBLY
    • Publication number 20230115306
    • Publication date Apr 13, 2023
    • Disco Corporation
    • Masaru Nakamura
    • B08 - CLEANING
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20230023820
    • Publication date Jan 26, 2023
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20230025741
    • Publication date Jan 26, 2023
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20230015352
    • Publication date Jan 19, 2023
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING METHOD
    • Publication number 20220402076
    • Publication date Dec 22, 2022
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PROCESSING WAFER AND PROCESSING APPARATUS FOR WAFER
    • Publication number 20220336282
    • Publication date Oct 20, 2022
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER LAMINATING METHOD
    • Publication number 20220310557
    • Publication date Sep 29, 2022
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING STACKED WAFER
    • Publication number 20220301934
    • Publication date Sep 22, 2022
    • Disco Corporation
    • Masaru NAKAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HOLDING TABLE MANUFACTURING METHOD
    • Publication number 20220184754
    • Publication date Jun 16, 2022
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROCESSING METHOD OF WAFER
    • Publication number 20220172952
    • Publication date Jun 2, 2022
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20220161384
    • Publication date May 26, 2022
    • Disco Corporation
    • Masaru Nakamura
    • B24 - GRINDING POLISHING
  • Information Patent Application

    PROCESSING METHOD OF WAFER
    • Publication number 20210335667
    • Publication date Oct 28, 2021
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210327744
    • Publication date Oct 21, 2021
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20210313747
    • Publication date Oct 7, 2021
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CRACK DETECTION METHOD
    • Publication number 20210270749
    • Publication date Sep 2, 2021
    • Disco Corporation
    • Masaru NAKAMURA
    • G01 - MEASURING TESTING
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210265209
    • Publication date Aug 26, 2021
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210257256
    • Publication date Aug 19, 2021
    • Disco Corporation
    • Masaru Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210159080
    • Publication date May 27, 2021
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210125870
    • Publication date Apr 29, 2021
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20210031307
    • Publication date Feb 4, 2021
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20210035826
    • Publication date Feb 4, 2021
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR