Masaru Nishinaka

Person

Otsu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plating target material, polyamic solution and polyimide resin solu...
- Patent number 8,889,250
- Issue date Nov 18, 2014
- Kaneka Corporation
- Kanji Shimoosako
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermoplastic polyimide resin film, multilayer body and method for...
- Patent number 8,313,831
- Issue date Nov 20, 2012
- Kaneka Corporation
- Shigeru Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solution, component for plating, insulating sheet, laminate, and pr...
- Patent number 8,092,900
- Issue date Jan 10, 2012
- Kaneka Corporation
- Kanji Shimoosako
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laminate comprising polyimide and conductor layer, multi-layer wiri...
- Patent number 7,662,429
- Issue date Feb 16, 2010
- Kaneka Corporation
- Shoji Hara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer structure and multilayer wiring board using the same
- Patent number 7,252,881
- Issue date Aug 7, 2007
- Kaneka Corporation
- Takashi Itoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polyimide film and process for producing the same
- Patent number 7,247,367
- Issue date Jul 24, 2007
- Kaneka Corporation
- Masaru Nishinaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide/metal laminate, and electric/electronic equipment bases,...
- Patent number 7,179,519
- Issue date Feb 20, 2007
- Kaneka Corporation
- Masaru Nishinaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition
- Patent number 7,115,681
- Issue date Oct 3, 2006
- Kaneka Corporation
- Kanji Shimo-Ohsako
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Laminate
- Patent number 7,101,619
- Issue date Sep 5, 2006
- Kaneka Corporation
- Masaru Nishinaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate
- Patent number 6,911,265
- Issue date Jun 28, 2005
- Kaneka Corporation
- Masaru Nishinaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
POLYIMIDE/METAL LAMINATE, AND ELECTRIC/ELECTRONIC EQUIPMENT BASES,...
- Patent number 6,586,081
- Issue date Jul 1, 2003
- Kaneka Corporation
- Masaru Nishinaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polyamide acid composition containing metal, polyimide film, flexib...
- Patent number 6,207,739
- Issue date Mar 27, 2001
- Kanegafuchi Kagaku Kogyo Kabushiki
- Kuzuhiro Ono
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Material for planting and use thereof
- Publication number 20090281267
- Publication date Nov 12, 2009
- Kanji Shimoosako
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Fiber-resin composite, laminate, printed wiring board, and method f...
- Publication number 20090025966
- Publication date Jan 29, 2009
- Kanji Shimoosako
- B32 - LAYERED PRODUCTS
Information Patent Application
Solution, Component for Plating, Insulating Sheet, Laminate, and Pr...
- Publication number 20080314618
- Publication date Dec 25, 2008
- KANEKA CORPORATION
- Kanji Shimoosako
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Plating Target Material, Polyamic Solution And Polyimide Resin Solu...
- Publication number 20070264490
- Publication date Nov 15, 2007
- Kaneka Corporation
- Kanji Shimoosako
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polyimide film, process for preparing the same and controlling isot...
- Publication number 20060138707
- Publication date Jun 29, 2006
- Kaneka Corporation
- Hidehito Nishimura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Thermoplastic polyimide resin film, multilayer body and method for...
- Publication number 20060115670
- Publication date Jun 1, 2006
- Shigeru Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Laminate, printed circuit board, and preparing method thereof
- Publication number 20060048963
- Publication date Mar 9, 2006
- Masaru Nishinaka
- B32 - LAYERED PRODUCTS
Information Patent Application
Laminate
- Publication number 20050221080
- Publication date Oct 6, 2005
- Kaneka Corporation
- Masaru Nishinaka
- B32 - LAYERED PRODUCTS
Information Patent Application
Laminate and its producing method
- Publication number 20040231141
- Publication date Nov 25, 2004
- Masaru Nishinaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin composition
- Publication number 20040176526
- Publication date Sep 9, 2004
- Kanji Shimo-Ohsako
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polyimide film and method for production thereof and method for adj...
- Publication number 20040087757
- Publication date May 6, 2004
- Hidehito Nishimura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Polymide film and process for producing the same
- Publication number 20040063898
- Publication date Apr 1, 2004
- Masaru Nishinaka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Polyimide/metal laminate, and electric/electronic equipment bases,...
- Publication number 20040048079
- Publication date Mar 11, 2004
- Kaneka Corporation
- Masaru Nishinaka
- B32 - LAYERED PRODUCTS
Information Patent Application
Multilayer structure and multilayer wiring board using the same
- Publication number 20030194573
- Publication date Oct 16, 2003
- Takashi Itoh
- B32 - LAYERED PRODUCTS
Information Patent Application
Laminate
- Publication number 20030113521
- Publication date Jun 19, 2003
- Masaru Nishinaka
- B32 - LAYERED PRODUCTS
Information Patent Application
Laminate comprising polyimide and conductor layer, multi-layer wiri...
- Publication number 20010030122
- Publication date Oct 18, 2001
- Shoji Hara
- B32 - LAYERED PRODUCTS

Masaru Nishinaka

Person

Patents Grantslast 30 patents

Plating target material, polyamic solution and polyimide resin solu...

Thermoplastic polyimide resin film, multilayer body and method for...

Solution, component for plating, insulating sheet, laminate, and pr...

Laminate comprising polyimide and conductor layer, multi-layer wiri...

Multilayer structure and multilayer wiring board using the same

Polyimide film and process for producing the same

Polyimide/metal laminate, and electric/electronic equipment bases,...

Resin composition

Laminate

Laminate

POLYIMIDE/METAL LAMINATE, AND ELECTRIC/ELECTRONIC EQUIPMENT BASES,...

Polyamide acid composition containing metal, polyimide film, flexib...

Patents Applicationslast 30 patents

Material for planting and use thereof

Fiber-resin composite, laminate, printed wiring board, and method f...

Solution, Component for Plating, Insulating Sheet, Laminate, and Pr...

Plating Target Material, Polyamic Solution And Polyimide Resin Solu...

Polyimide film, process for preparing the same and controlling isot...

Thermoplastic polyimide resin film, multilayer body and method for...

Laminate, printed circuit board, and preparing method thereof

Laminate

Laminate and its producing method

Resin composition

Polyimide film and method for production thereof and method for adj...

Polymide film and process for producing the same

Polyimide/metal laminate, and electric/electronic equipment bases,...

Multilayer structure and multilayer wiring board using the same

Laminate

Laminate comprising polyimide and conductor layer, multi-layer wiri...