Masaru Takahashi

Follow

Person

Ageo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electro-deposited copper foil, surface-treated copper foil using th...
- Patent number 9,307,639
- Issue date Apr 5, 2016
- Mitsui Mining & Smelting Co., Ltd.
- Hisao Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for printed-wiring board and copper-clad laminate using...
- Patent number 6,989,199
- Issue date Jan 24, 2006
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed wiring board for chip-on flexibles
- Patent number 6,984,456
- Issue date Jan 10, 2006
- Mitsui Mining & Smelting Co., Ltd.
- Kazuyuki Okada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil for printed wiring board
- Patent number 6,544,664
- Issue date Apr 8, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Naotomi Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR ROUGHENING TREATMENT OF COPPER FOIL AND COPPER FOIL FOR...
- Publication number 20110127074
- Publication date Jun 2, 2011
- Mitsui Mining and Smelting Co., Ltd.
- Masaru Takahashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRO-DEPOSITED COPPER FOIL, SURFACE-TREATED COPPER FOIL USING TH...
- Publication number 20090095515
- Publication date Apr 16, 2009
- Mitsui Mining and Smelting Co., Ltd.
- Hisao Sakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surface Treated Copper Foil, Flexible Copper-Clad Laminate Manufact...
- Publication number 20070237976
- Publication date Oct 11, 2007
- Mitsui Mining and Smelting Co., Ltd.
- Kazuyuki Okada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Flexible printed wiring board for chip-on-film
- Publication number 20040163842
- Publication date Aug 26, 2004
- Kazuyuki Okada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Printed wiring board-use copper foil and copper clad laminated shee...
- Publication number 20040053019
- Publication date Mar 18, 2004
- Takuya Yamamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR