TREA

Masaru Yamazaki

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  • Nagano-shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Solder bump forming method
    • Patent number 7,807,560
    • Issue date Oct 5, 2010
    • Shinko Electric Industries Co., Ltd.
    • Kei Imafuji
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Substrate transfer apparatus
    • Patent number 7,251,021
    • Issue date Jul 31, 2007
    • Shinko Electric Industries Co., Ltd.
    • Toshiaki Suyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Metal core substrate and process for manufacturing same
    • Patent number 6,767,616
    • Issue date Jul 27, 2004
    • Shinko Electric Industries Co., Ltd.
    • Kazuhiko Ooi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    SOLDER BUMP FORMING METHOD
    • Publication number 20090023281
    • Publication date Jan 22, 2009
    • Shinko Electric Industries Co., Ltd.
    • Kei Imafuji
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE TRANSFER APPARATUS
    • Publication number 20070070325
    • Publication date Mar 29, 2007
    • Shinko Electric Industries Co., Ltd.
    • Toshiaki Suyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Metal core substrate and process for manufacturing same
    • Publication number 20030215619
    • Publication date Nov 20, 2003
    • Shinko Electric Industries Co., Ltd.
    • Kazuhiko Ooi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR