Masashi Hamanaka

Person

Nara, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming wiring structure
- Patent number 6,919,267
- Issue date Jul 19, 2005
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming wiring structure
- Patent number 6,881,660
- Issue date Apr 19, 2005
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming wiring structure
- Patent number 6,858,549
- Issue date Feb 22, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masashi Hamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming wiring structure
- Patent number 6,759,322
- Issue date Jul 6, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hideaki Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming buried interconnect
- Patent number 6,737,348
- Issue date May 18, 2004
- Matsushita Electric Industrial Co., Ltd.
- Mitsunari Satake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for chemical/mechanical polishing
- Patent number 6,416,617
- Issue date Jul 9, 2002
- Matsushita Electronics Corporation
- Hideaki Yoshida
- B24 - GRINDING POLISHING
Information Patent Grant
Method for forming metallic plug
- Patent number 6,248,660
- Issue date Jun 19, 2001
- Matsushita Electronics Corporation
- Masashi Hamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for chemical/mechanical polishing
- Patent number 6,191,038
- Issue date Feb 20, 2001
- Matsushita Electronics Corporation
- Hideaki Yoshida
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Polishing method for semiconductor device, method for fabricating s...
- Publication number 20040127148
- Publication date Jul 1, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Masashi Hamanaka
- B24 - GRINDING POLISHING
Information Patent Application
Method for polishing semiconductor wafer and polishing pad for the...
- Publication number 20040097174
- Publication date May 20, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Eigo Shirakashi
- B24 - GRINDING POLISHING
Information Patent Application
Method for forming wiring structure
- Publication number 20040009653
- Publication date Jan 15, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming wiring structure
- Publication number 20030224594
- Publication date Dec 4, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hideaki Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming wiring structure
- Publication number 20030216033
- Publication date Nov 20, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming wiring structure
- Publication number 20030216019
- Publication date Nov 20, 2003
- Matsushita Electric Industrial Co., Ltd.
- Masashi Hamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming buried interconnect
- Publication number 20020168846
- Publication date Nov 14, 2002
- Mitsunari Satake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for chemical/mechanical polishing
- Publication number 20010000753
- Publication date May 3, 2001
- Matsushita Electronics Corporation
- Hideaki Yoshida
- B24 - GRINDING POLISHING

Masashi Hamanaka

Person

Patents Grantslast 30 patents

Method for forming wiring structure

Method for forming wiring structure

Method for forming wiring structure

Method for forming wiring structure

Method for forming buried interconnect

Apparatus and method for chemical/mechanical polishing

Method for forming metallic plug

Apparatus and method for chemical/mechanical polishing

Patents Applicationslast 30 patents

Polishing method for semiconductor device, method for fabricating s...

Method for polishing semiconductor wafer and polishing pad for the...

Method for forming wiring structure

Method for forming wiring structure

Method for forming wiring structure

Method for forming wiring structure

Method for forming buried interconnect

Apparatus and method for chemical/mechanical polishing