Masashi HAYAKAWA

Person

  • Okazaki-shi, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Component mounting device

    • Patent number 10,966,358
    • Issue date Mar 30, 2021
    • FUJI CORPORATION
    • Shigeto Oyama
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Die component supply device

    • Patent number 10,879,096
    • Issue date Dec 29, 2020
    • FUJI CORPORATION
    • Masashi Hayakawa
    • G01 - MEASURING TESTING

Patents Applicationslast 30 patents

  • Information Patent Application

    COMPONENT-MOUNTING DEVICE

    • Publication number 20210007255
    • Publication date Jan 7, 2021
    • FUJI CORPORATION
    • Masashi HAYAKAWA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DIE COMPONENT SUPPLY DEVICE

    • Publication number 20190355602
    • Publication date Nov 21, 2019
    • FUJI CORPORATION
    • Masashi HAYAKAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COMPONENT MOUNTING DEVICE

    • Publication number 20170215309
    • Publication date Jul 27, 2017
    • FUJI MACHINE MFG CO., LTD.
    • Shigeto OYAMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR