Masashi Ichikawa

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Fukushima, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer flatness evaluation method, wafer flatness evaluation apparat...
- Patent number 7,474,386
- Issue date Jan 6, 2009
- Kabushiki Kaisha Toshiba
- Tadahito Fujisawa
- G01 - MEASURING TESTING
Information Patent Grant
Wafer flatness evaluation method, wafer flatness evaluation apparat...
- Patent number 7,365,830
- Issue date Apr 29, 2008
- Kabushiki Kaisha Toshiba
- Tadahito Fujisawa
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 7,276,427
- Issue date Oct 2, 2007
- Shin-Etsu Handotai Co., Ltd.
- Masashi Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer flatness evaluation method, wafer flatness evaluation apparat...
- Patent number 7,230,680
- Issue date Jun 12, 2007
- Kabushiki Kaisha Toshiba
- Tadahito Fujisawa
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing semiconductor wafer, method for receiving...
- Patent number 7,203,559
- Issue date Apr 10, 2007
- Shin-Etsu Handotai Co., Ltd.
- Tatsuo Ito
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Surface Grinding Method and Manufacturing Method for Semiconductor...
- Publication number 20090203212
- Publication date Aug 13, 2009
- SHIN-ETSU HANDOTAI CO LTD
- Masashi Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer flatness evaluation method, wafer flatness evaluation apparat...
- Publication number 20070177126
- Publication date Aug 2, 2007
- Kabushiki Kaisha Toshiba
- Tadahito Fujisawa
- G01 - MEASURING TESTING
Information Patent Application
Wafer flatness evaluation method, wafer flatness evaluation apparat...
- Publication number 20070177127
- Publication date Aug 2, 2007
- Kabushiki Kaisha Toshiba
- Tadahito Fujisawa
- G01 - MEASURING TESTING
Information Patent Application
Method for manufacturing soi wafer
- Publication number 20060014330
- Publication date Jan 19, 2006
- Masashi Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer manufacturing method, semiconductor wafer mnauf...
- Publication number 20050085017
- Publication date Apr 21, 2005
- Tatsuo Ito
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Wafer flatness evaluation method, wafer flatness evaluation apparat...
- Publication number 20040185662
- Publication date Sep 23, 2004
- Tadahito Fujisawa
- G01 - MEASURING TESTING