Masashi Inaishi

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Aichi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board having solder bumps
- Patent number 6,660,944
- Issue date Dec 9, 2003
- NGK Spark Plug Co., Ltd.
- Haruhiko Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Film peeling apparatus and method of manufacturing wiring board
- Publication number 20060076104
- Publication date Apr 13, 2006
- NGK SPARK PLUG CO., LTD.
- Masashi Inaishi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL