Masashi KATAKAI

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Embedded component substrate with a metal core layer having an open...
- Patent number 10,043,726
- Issue date Aug 7, 2018
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED COMPONENT SUBSTRATE AND SEMICONDUCTOR MODULE
- Publication number 20160293537
- Publication date Oct 6, 2016
- Taiyo Yuden Co., Ltd.
- Yuichi SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS