Masashi Katsumata

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor IC-embedded substrate having heat dissipation structu...
- Patent number 11,682,628
- Issue date Jun 20, 2023
- TDK Corporation
- Kazutoshi Tsuyutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board
- Patent number 10,741,502
- Issue date Aug 11, 2020
- TDK Corporation
- Masashi Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board incorporating semiconductor IC and manufacturing meth...
- Patent number 10,515,898
- Issue date Dec 24, 2019
- TDK Corporation
- Kazutoshi Tsuyutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit module and manufacturing method of the same
- Patent number 10,225,923
- Issue date Mar 5, 2019
- TDK Corporation
- Yoshihiro Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC embedded substrate and method of manufacturing the same
- Patent number 9,153,553
- Issue date Oct 6, 2015
- TDK Corporation
- Kazutoshi Tsuyutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate and manufacturing method thereof
- Patent number 7,868,464
- Issue date Jan 11, 2011
- TDK Corporation
- Kenichi Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor IC-embedded module with multilayer substrates with mu...
- Patent number 7,812,444
- Issue date Oct 12, 2010
- TDK Corporation
- Masashi Katsumata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor element containing circuit board and power amplifier module
- Patent number 7,368,998
- Issue date May 6, 2008
- TDK Corporation
- Toshiyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor element containing circuit board and power amplifier module
- Patent number 7,176,756
- Issue date Feb 13, 2007
- TDK Corporation
- Toshiyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Front-end module and communication terminal
- Patent number 7,120,394
- Issue date Oct 10, 2006
- TDK Corporation
- Yoshihiro Suzuki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Surface mounting part
- Patent number 6,373,714
- Issue date Apr 16, 2002
- TDK Corporation
- Kazuo Kudoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voltage-controlled oscillator and method for adjusting frequency sh...
- Patent number 6,144,263
- Issue date Nov 7, 2000
- TDK Corporation
- Masashi Katsumata
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Voltage controlled oscillator and sensitivity adjustment
- Patent number 5,852,388
- Issue date Dec 22, 1998
- TDK Corporation
- Shinya Nakai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wave absorber, and an anechoic chamber using the same
- Patent number 4,972,191
- Issue date Nov 20, 1990
- TDK Corporation
- Ken Ishino
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR IC-EMBEDDED SUBSTRATE AND ITS MANUFACTURING METHOD
- Publication number 20200194375
- Publication date Jun 18, 2020
- TDK Corporation
- Kazutoshi TSUYUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT BOARD
- Publication number 20190164904
- Publication date May 30, 2019
- TDK Corporation
- Masashi KATSUMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD INCORPORATING SEMICONDUCTOR IC AND MANUFACTURING METH...
- Publication number 20180337131
- Publication date Nov 22, 2018
- TDK Corporation
- Kazutoshi TSUYUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT MODULE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20170295643
- Publication date Oct 12, 2017
- TDK Corporation
- Yoshihiro SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IC EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150145145
- Publication date May 28, 2015
- TDK Corporation
- Kazutoshi TSUYUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor-embedded substrate and manufacturing method thereof
- Publication number 20080079146
- Publication date Apr 3, 2008
- TDK Corporation
- Yasuyuki Hattori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTOR ELEMENT CONTAINING CIRCUIT BOARD AND POWER AMPLIFIER MODULE
- Publication number 20070075767
- Publication date Apr 5, 2007
- TDK Corporation
- Toshiyuki Abe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor IC-embedded module
- Publication number 20070057366
- Publication date Mar 15, 2007
- Masashi Katsumata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer substrate and manufacturing method thereof
- Publication number 20060057341
- Publication date Mar 16, 2006
- TDK CORPORATION
- Kenichi Kawabata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Inductor element containing circuit board and power amplifier module
- Publication number 20050140434
- Publication date Jun 30, 2005
- TDK Corporation
- Toshiyuki Abe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Front-end module and communication terminal
- Publication number 20040152426
- Publication date Aug 5, 2004
- TDK Corporation
- Yoshihiro Suzuki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Masashi Katsumata

Person

Patents Grantslast 30 patents

Semiconductor IC-embedded substrate having heat dissipation structu...

Multilayer circuit board

Circuit board incorporating semiconductor IC and manufacturing meth...

Electronic circuit module and manufacturing method of the same

IC embedded substrate and method of manufacturing the same

Multilayer substrate and manufacturing method thereof

Semiconductor IC-embedded module with multilayer substrates with mu...

Inductor element containing circuit board and power amplifier module

Inductor element containing circuit board and power amplifier module

Front-end module and communication terminal

Surface mounting part

Voltage-controlled oscillator and method for adjusting frequency sh...

Voltage controlled oscillator and sensitivity adjustment

Wave absorber, and an anechoic chamber using the same

Patents Applicationslast 30 patents

SEMICONDUCTOR IC-EMBEDDED SUBSTRATE AND ITS MANUFACTURING METHOD

MULTILAYER CIRCUIT BOARD

CIRCUIT BOARD INCORPORATING SEMICONDUCTOR IC AND MANUFACTURING METH...

ELECTRONIC CIRCUIT MODULE AND MANUFACTURING METHOD OF THE SAME

IC EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Semiconductor-embedded substrate and manufacturing method thereof

INDUCTOR ELEMENT CONTAINING CIRCUIT BOARD AND POWER AMPLIFIER MODULE

Semiconductor IC-embedded module

Multilayer substrate and manufacturing method thereof

Inductor element containing circuit board and power amplifier module

Front-end module and communication terminal