Masashi KIKUCHI

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electrostatic chuck and wafer etching device including the same
- Patent number 11,728,198
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Myoung-Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer loading apparatus and film forming apparatus
- Patent number 10,718,053
- Issue date Jul 21, 2020
- Samsung Electronics Co., Ltd.
- Kazuyuki Tomizawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ELECTROSTATIC CHUCK AND WAFER ETCHING DEVICE INCLUDING THE SAME
- Publication number 20200066565
- Publication date Feb 27, 2020
- Samsung Electronics Co., Ltd.
- Myoung-soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMING APPARATUS
- Publication number 20190177841
- Publication date Jun 13, 2019
- Samsung Electronics Co., Ltd.
- Kazuyuki TOMIZAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER LOADING APPARATUS AND FILM FORMING APPARATUS
- Publication number 20190177847
- Publication date Jun 13, 2019
- Samsung Electronics Co., Ltd.
- Kazuyuki TOMIZAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...