Masashi Konda

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Process and apparatus for forming ball bumps
- Patent number 5,857,610
- Issue date Jan 12, 1999
- Nippon Steel Corporation
- Hiroshi Hoshiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for forming ball bumps
- Patent number 5,803,339
- Issue date Sep 8, 1998
- Nippon Steel Corporation
- Hiroshi Hoshiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for forming ball bumps
- Patent number 5,687,901
- Issue date Nov 18, 1997
- Nippon Steel Corporation
- Hiroshi Hoshiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with jumping wire
- Patent number 5,362,984
- Issue date Nov 8, 1994
- Nippon Steel Corporation
- Masashi Konda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiator for semiconductor chip
- Patent number 5,150,198
- Issue date Sep 22, 1992
- Nippon Steel Corporation
- Naoharu Ohikata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead structure for packaging semiconductor chip
- Patent number 5,137,479
- Issue date Aug 11, 1992
- Nippon Steel Corporation
- Naoharu Ohikata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding bumps to leads of tab tape and an apparatus for a...
- Patent number 5,114,878
- Issue date May 19, 1992
- Nippon Steel Corporation
- Tadakatsu Maruyama
- H01 - BASIC ELECTRIC ELEMENTS