Masashi Kumagai

Person

Kitaibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Two-layer flexible substrate
- Patent number 8,568,856
- Issue date Oct 29, 2013
- Nippon Mining & Metals Co., Ltd.
- Katsuyuki Tsuchida
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper electrolytic solution containing amine compound having speci...
- Patent number 8,449,751
- Issue date May 28, 2013
- Nippon Mining & Metals Co., Ltd.
- Masashi Kumagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless nickel plating liquid
- Patent number 8,182,594
- Issue date May 22, 2012
- Nippon Mining & Metals Co., Ltd
- Eiji Hino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper electrolytic solution containing as additive compound having...
- Patent number 7,824,534
- Issue date Nov 2, 2010
- Nippon Mining & Metals Co., Ltd.
- Katsuyuki Tsuchida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrolytic solution and electrolytic copper foil produced...
- Patent number 7,777,078
- Issue date Aug 17, 2010
- Nikko Materials Co., Ltd.
- Masashi Kumagai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Copper electrolytic solution containing quaternary amine compound w...
- Patent number 7,771,835
- Issue date Aug 10, 2010
- Nippon Mining & Metals Co., Ltd.
- Masashi Kumagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper electrolytic solution containing quaternary amine compound p...
- Patent number 7,678,257
- Issue date Mar 16, 2010
- Nikko Materials Co., Ltd.
- Masashi Kumagai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Surface treated copper film
- Patent number 7,651,783
- Issue date Jan 26, 2010
- Nikko Materials Co., Ltd.
- Katsuyuki Tsuchida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Basic silane coupling agent organic carboxylate composition, method...
- Patent number 7,432,335
- Issue date Oct 7, 2008
- Nikko Materials Co., Ltd.
- Masashi Kumagai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Copper electrolytic solution containing amine compound having speci...
- Patent number 7,378,160
- Issue date May 27, 2008
- Nikko Materials Co., Ltd.
- Masashi Kumagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless gold plating liquid
- Patent number 7,300,501
- Issue date Nov 27, 2007
- Nikko Materials Co., Ltd.
- Eiji Hino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper electrolytic solution containing organic sulfur compound and...
- Patent number 7,144,491
- Issue date Dec 5, 2006
- Nikko Materials Co., Ltd.
- Masashi Kumagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid silane coupling agent composition, process for producing the...
- Patent number 7,109,273
- Issue date Sep 19, 2006
- Nikko Materials Co., Ltd.
- Katsuyuki Tsuchida
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Basic silane coupling agent organic carboxylate composition, method...
- Patent number 7,094,845
- Issue date Aug 22, 2006
- Nikko Materials Co., Ltd.
- Masashi Kumagai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Metal plating method, pretreatment agent, and semiconductor wafer a...
- Patent number 7,045,461
- Issue date May 16, 2006
- Nikkon Materials Co., Ltd.
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper electrolytic solution containing amine compound having speci...
- Patent number 7,005,055
- Issue date Feb 28, 2006
- Nikko Materials Co., Ltd.
- Masashi Kumagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Water-based metal surface treatment agent
- Patent number 6,921,577
- Issue date Jul 26, 2005
- Nikko Materials Co., Ltd.
- Takashi Ouchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Organic carboxylic acid salt composition, process for preparation t...
- Patent number 6,916,865
- Issue date Jul 12, 2005
- Nikko Materials Co., Ltd.
- Masashi Kumagai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Surface treatment for copper foil
- Patent number 6,835,241
- Issue date Dec 28, 2004
- Nikko Materials Co., Ltd.
- Katsuyuki Tsuchida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Imidazole/organic monocarboxylic acid salt derivative reaction prod...
- Patent number 6,710,181
- Issue date Mar 23, 2004
- Nikko Materials Co., Ltd.
- Masashi Kumagai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal surface treatment agent, and metal material coated with same
- Patent number 6,605,356
- Issue date Aug 12, 2003
- Nikko Materials Co., Ltd.
- Takashi Ouchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Imidazole-silane compounds and metal surface finishing agent contai...
- Patent number 5,258,522
- Issue date Nov 2, 1993
- Nippon Mining Co., Ltd
- Katsuyuki Tsuchida
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
Copper electrolytic solution and electrolytic copper foil produced...
- Publication number 20100270163
- Publication date Oct 28, 2010
- Nikko Materials Co., Ltd.
- Masashi Kumagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper electrolytic solution containing as additive compound having...
- Publication number 20100224496
- Publication date Sep 9, 2010
- NIPPON MINING & METALS CO., LTD.
- Katsuyuki Tsuchida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Two-Layer Flexible Substrate
- Publication number 20090092789
- Publication date Apr 9, 2009
- Katsuyuki Tsuchida
- B32 - LAYERED PRODUCTS
Information Patent Application
Electroless nickel plating liquid
- Publication number 20090064892
- Publication date Mar 12, 2009
- Eiji Hino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper electrolytic solution containing quaternary amine compound p...
- Publication number 20080075972
- Publication date Mar 27, 2008
- Nikko Materials Co., Ltd.
- Masashi Kumagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper electrolytic solution containing amine compound having speci...
- Publication number 20080073219
- Publication date Mar 27, 2008
- Nikko Materials Co., Ltd.
- Masashi Kumagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper electrolytic solution containing as additive compound having...
- Publication number 20070170069
- Publication date Jul 26, 2007
- Katsuyuki Tsuchida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surface processing agent for tin or tin alloy material
- Publication number 20070131141
- Publication date Jun 14, 2007
- Tamiharu Masatoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin composition
- Publication number 20070123681
- Publication date May 31, 2007
- NIKKO MATERIALS CO., LTD.
- Hironori Kobayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Electroless gold plating liquid
- Publication number 20070095249
- Publication date May 3, 2007
- Eiji Hino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper electrolytic solution containing quaternary amine compound w...
- Publication number 20070042201
- Publication date Feb 22, 2007
- Nikko Materials Co., Ltd.
- Masashi Kumagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Basic silane coupling agent organic carboxylate composition, method...
- Publication number 20060217494
- Publication date Sep 28, 2006
- Nikko Materials Co., Ltd.
- Masashi Kumagai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Copper electrolytic solution and electrolytic copper foil produced...
- Publication number 20060166032
- Publication date Jul 27, 2006
- Masashi Kumagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper electrolytic solution containing quaternary amine compound p...
- Publication number 20060011488
- Publication date Jan 19, 2006
- Masashi Kumagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper electrolytic solution containing amine compound having speci...
- Publication number 20050252778
- Publication date Nov 17, 2005
- Nikko Materials Co., Ltd.
- Masashi Kumagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper electrolytic solution containing organic sulfur compound and...
- Publication number 20050173256
- Publication date Aug 11, 2005
- Masashi Kumagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Solid silane coupling agent composition, process for producing the...
- Publication number 20050165195
- Publication date Jul 28, 2005
- Katsuyuki Tsuchida
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Surface-treated copper foil
- Publication number 20040209109
- Publication date Oct 21, 2004
- Katsuyuki Tsuchida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal plating method, pretreatment agent, and semiconductor wafer a...
- Publication number 20040182714
- Publication date Sep 23, 2004
- Nikko Materials Co., Ltd.
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Surface treatment for copper foil
- Publication number 20040149167
- Publication date Aug 5, 2004
- Katsuyuki Tsuchida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper electrolyte comprising amine compound having specific skelet...
- Publication number 20040149583
- Publication date Aug 5, 2004
- Masashi Kumagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Basic silane coupling agent-organic carboxylic acid salt compositio...
- Publication number 20040034136
- Publication date Feb 19, 2004
- Masashi Kumagai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Monocarboxylate salts of imidazole reaction products, process for p...
- Publication number 20030088108
- Publication date May 8, 2003
- Masashi Kumagai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Metal surface treatment agent, and metal material coated with same
- Publication number 20030054174
- Publication date Mar 20, 2003
- Takashi Ouchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Water-based metal surface treatment agent
- Publication number 20030017343
- Publication date Jan 23, 2003
- Takashi Ouchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Masashi Kumagai

Person

Patents Grantslast 30 patents

Two-layer flexible substrate

Copper electrolytic solution containing amine compound having speci...

Electroless nickel plating liquid

Copper electrolytic solution containing as additive compound having...

Copper electrolytic solution and electrolytic copper foil produced...

Copper electrolytic solution containing quaternary amine compound w...

Copper electrolytic solution containing quaternary amine compound p...

Surface treated copper film

Basic silane coupling agent organic carboxylate composition, method...

Copper electrolytic solution containing amine compound having speci...

Electroless gold plating liquid

Copper electrolytic solution containing organic sulfur compound and...

Solid silane coupling agent composition, process for producing the...

Basic silane coupling agent organic carboxylate composition, method...

Metal plating method, pretreatment agent, and semiconductor wafer a...

Copper electrolytic solution containing amine compound having speci...

Water-based metal surface treatment agent

Organic carboxylic acid salt composition, process for preparation t...

Surface treatment for copper foil

Imidazole/organic monocarboxylic acid salt derivative reaction prod...

Metal surface treatment agent, and metal material coated with same

Imidazole-silane compounds and metal surface finishing agent contai...

Patents Applicationslast 30 patents

Copper electrolytic solution and electrolytic copper foil produced...

Copper electrolytic solution containing as additive compound having...

Two-Layer Flexible Substrate

Electroless nickel plating liquid

Copper electrolytic solution containing quaternary amine compound p...

Copper electrolytic solution containing amine compound having speci...

Copper electrolytic solution containing as additive compound having...

Surface processing agent for tin or tin alloy material

Resin composition

Electroless gold plating liquid

Copper electrolytic solution containing quaternary amine compound w...

Basic silane coupling agent organic carboxylate composition, method...

Copper electrolytic solution and electrolytic copper foil produced...

Copper electrolytic solution containing quaternary amine compound p...

Copper electrolytic solution containing amine compound having speci...

Copper electrolytic solution containing organic sulfur compound and...

Solid silane coupling agent composition, process for producing the...

Surface-treated copper foil

Metal plating method, pretreatment agent, and semiconductor wafer a...

Surface treatment for copper foil

Copper electrolyte comprising amine compound having specific skelet...

Basic silane coupling agent-organic carboxylic acid salt compositio...

Monocarboxylate salts of imidazole reaction products, process for p...

Metal surface treatment agent, and metal material coated with same

Water-based metal surface treatment agent