Masashi Ogita

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Nagano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing interconnect metallization comprising metal...
- Patent number 5,312,772
- Issue date May 17, 1994
- Seiko Epson Corporation
- Kenji Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ohmic contact to silicon substrate
- Patent number 4,998,157
- Issue date Mar 5, 1991
- Seiko Epson Corporation
- Kenji Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS