Masashi OKANIWA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Film, laminate, semiconductor wafer with film layer, substrate for...
- Patent number 12,195,566
- Issue date Jan 14, 2025
- Mitsubishi Gas Chemical Company, Inc.
- Takahito Sekido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, laminate, semiconductor wafer with resin composi...
- Patent number 11,935,803
- Issue date Mar 19, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Masashi Okaniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, laminate, semiconductor wafer with resin composi...
- Patent number 11,924,979
- Issue date Mar 5, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Masashi Okaniwa
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR...
- Publication number 20220389130
- Publication date Dec 8, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Masashi OKANIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, RESIN SHEET, LAMINATE, SEMICONDUCTOR WAFER WITH...
- Publication number 20220380508
- Publication date Dec 1, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Masashi OKANIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR...
- Publication number 20220344227
- Publication date Oct 27, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Masashi OKANIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR...
- Publication number 20220332868
- Publication date Oct 20, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Takahito SEKIDO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...
- Publication number 20210277221
- Publication date Sep 9, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Masashi OKANIWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...
- Publication number 20210147680
- Publication date May 20, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Kohei HIGASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...
- Publication number 20210147629
- Publication date May 20, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Masashi OKANIWA
- H01 - BASIC ELECTRIC ELEMENTS

Masashi OKANIWA

Person

Patents Grantslast 30 patents

Film, laminate, semiconductor wafer with film layer, substrate for...

Resin composition, laminate, semiconductor wafer with resin composi...

Resin composition, laminate, semiconductor wafer with resin composi...

Patents Applicationslast 30 patents

FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR...

RESIN COMPOSITION, RESIN SHEET, LAMINATE, SEMICONDUCTOR WAFER WITH...

FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR...

FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR...

RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...

RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...

RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSI...