Masashi Takase

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with crack-resistant multilayer copper wiring
- Patent number 7,800,227
- Issue date Sep 21, 2010
- Fujitsu Semiconductor Limited
- Masamichi Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit and method for making wiring layou...
- Patent number 6,013,924
- Issue date Jan 11, 2000
- Fujitsu Limited
- Toru Osajima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device
- Publication number 20060097396
- Publication date May 11, 2006
- FUJITSU LIMITED
- Masamichi Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060022691
- Publication date Feb 2, 2006
- FUJITSU LIMITED
- Takanori Watanabe
- G01 - MEASURING TESTING