Masataka Matsunaga

Person

Kumamoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate transfer device and bonding system
- Patent number 10,424,502
- Issue date Sep 24, 2019
- Tokyo Electron Limited
- Masataka Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding systems
- Patent number 10,340,248
- Issue date Jul 2, 2019
- Tokyo Electron Limited
- Masataka Matsunaga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding system
- Patent number 9,607,869
- Issue date Mar 28, 2017
- Tokyo Electron Limited
- Masataka Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation system, separation method, program and computer storage...
- Patent number 9,330,898
- Issue date May 3, 2016
- Tokyo Electron Limited
- Osamu Hirakawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Peeling system, peeling method, and computer storage medium
- Patent number 9,165,758
- Issue date Oct 20, 2015
- Tokyo Electron Limited
- Naoto Yoshitaka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Coating and developing apparatus and pattern forming method
- Patent number 6,814,809
- Issue date Nov 9, 2004
- Tokyo Electron Limited
- Michiaki Matsushita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING SYSTEM
- Publication number 20230207331
- Publication date Jun 29, 2023
- TOKYO ELECTRON LIMITED
- Takuo Kawauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM
- Publication number 20180019226
- Publication date Jan 18, 2018
- TOKYO ELECTRON LIMITED
- Masataka MATSUNAGA
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE TRANSFER DEVICE AND BONDING SYSTEM
- Publication number 20180019153
- Publication date Jan 18, 2018
- TOKYO ELECTRON LIMITED
- Masataka MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding System
- Publication number 20180019225
- Publication date Jan 18, 2018
- TOKYO ELECTRON LIMITED
- Masataka MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM
- Publication number 20150059985
- Publication date Mar 5, 2015
- TOKYO ELECTRON LIMITED
- Masataka Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND BONDING METHOD
- Publication number 20140158303
- Publication date Jun 12, 2014
- TOKYO ELECTRON LIMITED
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEELING SYSTEM, PEELING METHOD, AND COMPUTER STORAGE MEDIUM
- Publication number 20130280825
- Publication date Oct 24, 2013
- TOKYO ELECTRON LIMITED
- Naoto Yoshitaka
- B32 - LAYERED PRODUCTS
Information Patent Application
JOINT SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND JOINT METHOD
- Publication number 20130153116
- Publication date Jun 20, 2013
- TOKYO ELECTRON LIMITED
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATION SYSTEM, SEPARATION METHOD, PROGRAM AND COMPUTER STORAGE...
- Publication number 20130146229
- Publication date Jun 13, 2013
- TOKYO ELECTRON LIMITED
- Osamu Hirakawa
- B32 - LAYERED PRODUCTS
Information Patent Application
JOINT APPARATUS, JOINT SYSTEM, AND JOINT METHOD
- Publication number 20130062013
- Publication date Mar 14, 2013
- TOKYO ELECTRON LIMITED
- Shinji OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coating and developing apparatus and pattern forming method
- Publication number 20050042555
- Publication date Feb 24, 2005
- TOKYO ELECTRON LIMITED
- Michiaki Matsushita
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Coating and developing apparatus and pattern forming method
- Publication number 20020076658
- Publication date Jun 20, 2002
- TOKYO ELECTRON LIMITED
- Michiaki Matsushita
- H01 - BASIC ELECTRIC ELEMENTS

Masataka Matsunaga

Person

Patents Grantslast 30 patents

Bonding system

Substrate transfer device and bonding system

Bonding systems

Bonding system

Separation system, separation method, program and computer storage...

Peeling system, peeling method, and computer storage medium

Coating and developing apparatus and pattern forming method

Patents Applicationslast 30 patents

BONDING SYSTEM

BONDING SYSTEM

SUBSTRATE TRANSFER DEVICE AND BONDING SYSTEM

Bonding System

BONDING SYSTEM

BONDING SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND BONDING METHOD

PEELING SYSTEM, PEELING METHOD, AND COMPUTER STORAGE MEDIUM

JOINT SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND JOINT METHOD

SEPARATION SYSTEM, SEPARATION METHOD, PROGRAM AND COMPUTER STORAGE...

JOINT APPARATUS, JOINT SYSTEM, AND JOINT METHOD

Coating and developing apparatus and pattern forming method

Coating and developing apparatus and pattern forming method