Masataka Takehara

Person

Fukuoka-shi, Fukuoka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Mold clamping device with improved clamping force transmission mech...
- Patent number 6,402,497
- Issue date Jun 11, 2002
- Toshinobu Banjyo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optical semiconductor device for optical communications with increa...
- Patent number 5,606,182
- Issue date Feb 25, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Masaharu Yoshida
- G02 - OPTICS
Information Patent Grant
Bonding method and apparatus
- Patent number 5,500,502
- Issue date Mar 19, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Manabu Horita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method and bonding apparatus
- Patent number 5,305,944
- Issue date Apr 26, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Masaharu Yoshida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 5,220,196
- Issue date Jun 15, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having particular lead structure for m...
- Patent number 5,105,261
- Issue date Apr 14, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,067,005
- Issue date Nov 19, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular semiconductor device
- Patent number 5,025,307
- Issue date Jun 18, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS

Masataka Takehara

Person

Patents Grantslast 30 patents

Mold clamping device with improved clamping force transmission mech...

Optical semiconductor device for optical communications with increa...

Bonding method and apparatus

Bonding method and bonding apparatus

Semiconductor device

Semiconductor device package having particular lead structure for m...

Semiconductor device

Modular semiconductor device