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Masataka Watabe
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Multi-layer ceramic electronic component
Patent number
11,557,439
Issue date
Jan 17, 2023
Taiyo Yuden Co., Ltd.
Yasutomo Suga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer ceramic electronic component
Patent number
11,017,952
Issue date
May 25, 2021
Taiyo Yuden Co., Ltd.
Yasutomo Suga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer ceramic electronic component
Patent number
10,395,830
Issue date
Aug 27, 2019
Taiyo Yuden Co., Ltd.
Masataka Watabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer ceramic electronic component
Patent number
10,354,801
Issue date
Jul 16, 2019
Taiyo Yuden Co., Ltd.
Masataka Watabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component package and method of housing an electronic co...
Patent number
10,319,658
Issue date
Jun 11, 2019
Taiyo Yuden Co., Ltd.
Yasutomo Suga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low-height multilayer ceramic capacitor
Patent number
9,502,181
Issue date
Nov 22, 2016
Taiyo Yuden Co., Ltd.
Yasutomo Suga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mounting structure of chip component
Patent number
8,958,213
Issue date
Feb 17, 2015
Taiyo Yuden Co., Ltd.
Yuji Hoshi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Laminated capacitor
Patent number
8,810,993
Issue date
Aug 19, 2014
Taiyo Yuden Co., Ltd.
Yuji Hoshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laminated capacitor
Patent number
8,564,930
Issue date
Oct 22, 2013
Taiyo Yuden Co., Ltd.
Yuji Hoshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder circuit
Patent number
6,476,487
Issue date
Nov 5, 2002
Showa Denko K.K.
Takeo Kuramoto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of forming solder film
Patent number
5,928,440
Issue date
Jul 27, 1999
Showa Denko K.K.
Takeo Kuramoto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of forming solder film
Patent number
5,750,271
Issue date
May 12, 1998
Showa Denko K.K.
Takeo Kuramoto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solution for selectively imparting tackiness to a metallic surface
Patent number
5,713,997
Issue date
Feb 3, 1998
Showa Denko K.K.
Takeo Kuramoto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of forming solder film
Patent number
5,556,023
Issue date
Sep 17, 1996
Showa Denko K.K.
Takeo Kuramoto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT
Publication number
20210280375
Publication date
Sep 9, 2021
Taiyo Yuden Co., Ltd.
YASUTOMO SUGA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT
Publication number
20200027662
Publication date
Jan 23, 2020
Taiyo Yuden Co., Ltd.
YASUTOMO SUGA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-Layer Ceramic Electronic Component
Publication number
20180218840
Publication date
Aug 2, 2018
Taiyo Yuden Co., Ltd.
Masataka Watabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Component Package and Method of Housing an Electronic Co...
Publication number
20180218958
Publication date
Aug 2, 2018
Taiyo Yuden Co., Ltd.
Yasutomo Suga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-Layer Ceramic Electronic Component
Publication number
20180218839
Publication date
Aug 2, 2018
Taiyo Yuden Co., Ltd.
Masataka Watabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW-HEIGHT MULTILAYER CERAMIC CAPACITOR
Publication number
20140285947
Publication date
Sep 25, 2014
Taiyo Yuden Co., Ltd.
Yasutomo SUGA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LAMINATED CAPACITOR
Publication number
20140016241
Publication date
Jan 16, 2014
Taiyo Yuden Co., Ltd.
Yuji HOSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOUNTING STRUCTURE OF ELECTRIC CHIP DEVICE
Publication number
20140003014
Publication date
Jan 2, 2014
Yuji Hoshi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LAMINATED CAPACITOR
Publication number
20120262837
Publication date
Oct 18, 2012
Taiyo Yuden Co., Ltd.
Yuji HOSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Solder circuit
Publication number
20010020744
Publication date
Sep 13, 2001
Takeo Kuramoto
H01 - BASIC ELECTRIC ELEMENTS